Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381280 | Semiconductor packages and methods for forming semiconductor package | John Ducyao Beleran, Serafin P. Pedron, Jr. | 2019-08-13 |
| 10354934 | Semiconductor packages and methods of packaging semiconductor devices | Antonio Jr. Bambalan Dimaano, Rui Huang, Hua Tan, Kriangsak Sae Le, Beng Yeung Ho +3 more | 2019-07-16 |
| 9978658 | Semiconductor packages and methods of packaging semiconductor devices | Antonio Jr. Bambalan Dimaano, Rui Huang, Hua Tan, Kriangsak Sae Le, Beng Yeung Ho +3 more | 2018-05-22 |
| 9881863 | Semiconductor packages and methods of packaging semiconductor devices | Chuen Khiang Wang, Kriangsak Sae Le, Antonio Jr B Dimaano, Catherine Bee Liang Ng, Richard Te Gan +1 more | 2018-01-30 |
| 9842775 | Semiconductor device and method of forming a thin wafer without a carrier | Pandi C. Marimuthu, Shuangwu Huang | 2017-12-12 |
| 9741619 | Methods for singulating semiconductor wafer | William John Nelson, Beng Yeung Ho, Poh Leng Wilson Ong | 2017-08-22 |
| 9613877 | Semiconductor packages and methods for forming semiconductor package | John Ducyao Beleran, Serafin P. Pedron, Jr. | 2017-04-04 |
| 9589875 | Semiconductor packages and methods of packaging semiconductor devices | Chuen Khiang Wang, Kriangsak Sae Le, Antonio Jr B Dimaano, Catherine Bee Liang Ng, Richard Te Gan +1 more | 2017-03-07 |
| 9583446 | Semiconductor device and method of forming a shielding layer between stacked semiconductor die | Reza A. Pagaila, Byung Tai Do | 2017-02-28 |
| 9570314 | Methods for singulating semiconductor wafer | William John Nelson, Beng Yeung Ho, Poh Leng Wilson Ong | 2017-02-14 |
| 9508623 | Semiconductor packages and methods of packaging semiconductor devices | Antonio Jr. Bambalan Dimaano, Rui Huang, Hua Tan, Kriangsak Sae Le, Beng Yeung Ho +3 more | 2016-11-29 |
| 9472532 | Leadframe area array packaging technology | Antonio B. Dimaano, Jr., Yong Bo Yang | 2016-10-18 |
| 9443762 | Semiconductor device and method of forming a thin wafer without a carrier | Pandi C. Marimuthu, Shuangwu Huang | 2016-09-13 |
| 9236352 | Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die | Reza A. Pagaila, Byung Tai Do, Shuangwu Huang, Dioscoro A. Merilo | 2016-01-12 |
| 9136142 | Semiconductor packages and methods of packaging semiconductor devices | Chuen Khiang Wang, Kriangsak Sae Le, Antonio Jr B Dimaano, Catherine Bee Liang Ng, Richard Te Gan +1 more | 2015-09-15 |
| 9054083 | Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support | Pandi C. Marimuthu, Jae Hun Ku, Glenn Omandam, Hin Hwa Goh, Kock Liang Heng +1 more | 2015-06-09 |
| 9029193 | Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support | Pandi C. Marimuthu, Kock Liang Heng | 2015-05-12 |
| 9023690 | Leadframe area array packaging technology | Antonio B. Dimaano, Jr., Yong Bo Yang | 2015-05-05 |
| 8907498 | Semiconductor device and method of forming a shielding layer between stacked semiconductor die | Reza A. Pagaila, Byung Tai Do | 2014-12-09 |
| 8860079 | Semiconductor packages and methods of packaging semiconductor devices | Catherine Bee Liang Ng, Kriangsak Sae Le, Chuen Khiang Wang | 2014-10-14 |
| 8829666 | Semiconductor packages and methods of packaging semiconductor devices | Catherine Bee Liang Ng, Kriangsak Sae Le, Chuen Khiang Wang | 2014-09-09 |
| 8716873 | Semiconductor packages and methods of packaging semiconductor devices | Chuen Khiang Wang, Kriangsak Sae Le, Antonio Jr B Dimaano, Catherine Bee Liang Ng, Richard Te Gan +1 more | 2014-05-06 |
| 8703610 | Semiconductor device and method of forming conductive TSV with insulating annular ring | Reza A. Pagaila, Byung Tai Do | 2014-04-22 |
| 8659162 | Semiconductor device having an interconnect structure with TSV using encapsulant for structural support | Pandi C. Marimuthu, Jae Hun Ku, Glenn Omandam, Hin Hwa Goh, Kock Liang Heng +1 more | 2014-02-25 |
| 8531015 | Semiconductor device and method of forming a thin wafer without a carrier | Pandi C. Marimuthu, Shuangwu Huang | 2013-09-10 |