Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281259 | Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in FO-WLCSP | Yaojian Lin, Kang Chen, Jose Alvin Caparas | 2016-03-08 |
| 9054083 | Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Jae Hun Ku, Hin Hwa Goh, Kock Liang Heng +1 more | 2015-06-09 |
| 8916416 | Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surface | Yaojian Lin, Hin Hwa Goh | 2014-12-23 |
| 8659162 | Semiconductor device having an interconnect structure with TSV using encapsulant for structural support | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Jae Hun Ku, Hin Hwa Goh, Kock Liang Heng +1 more | 2014-02-25 |
| 8610286 | Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in Fo-WLCSP | Yaojian Lin, Kang Chen, Jose Alvin Caparas | 2013-12-17 |
| 8067308 | Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Jae Hun Ku, Hin Hwa Goh, Kock Liang Heng +1 more | 2011-11-29 |
| 7829384 | Semiconductor device and method of laser-marking wafers with tape applied to its active surface | Sheila Marie L. Alvarez, Ma. Shirley Asoy | 2010-11-09 |