Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381141 | Semiconductor device and method of forming hybrid substrate with uniform thickness | Yaojian Lin, Linda Pei Ee Chua, Jian Zuo | 2025-08-05 |
| 10790158 | Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern | Yaojian Lin, Kang Chen, Il Kwon Shim | 2020-09-29 |
| 10297556 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Jose Alvin Caparas, Kang Chen, Seng Guan Chow, Yaojian Lin | 2019-05-21 |
| 10177010 | Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern | Yaojian Lin, Kang Chen, Il Kwon Shim | 2019-01-08 |
| 10163747 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Jose Alvin Caparas, Kang Chen, Seng Guan Chow, Yaojian Lin | 2018-12-25 |
| 9666500 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Yu Gu, Il Kwon Shim +4 more | 2017-05-30 |
| 9607965 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Jose Alvin Caparas, Kang Chen, Seng Guan Chow, Yaojian Lin | 2017-03-28 |
| 9449943 | Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern | Yaojian Lin, Kang Chen, II Kwon Shim | 2016-09-20 |
| 9236278 | Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof | Rui Huang, Xusheng Bao, Kang Chen, Yung Kuan Hsiao | 2016-01-12 |
| 9142428 | Semiconductor device and method of forming FO-WLCSP with multiple encapsulants | Yaojian Lin, Jose Alvin Caparas, Kang Chen | 2015-09-22 |
| 9087930 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Yu Gu, Il Kwon Shim +4 more | 2015-07-21 |
| 9054083 | Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Jae Hun Ku, Glenn Omandam, Kock Liang Heng +1 more | 2015-06-09 |
| 8916416 | Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surface | Glenn Omandam, Yaojian Lin | 2014-12-23 |
| 8766426 | Integrated circuit packaging system with warpage control and method of manufacture thereof | Xusheng Bao, Yung Kuan Hsiao, Kang Chen, Rui Huang | 2014-07-01 |
| 8759155 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Yu Gu, Il Kwon Shim +4 more | 2014-06-24 |
| 8659162 | Semiconductor device having an interconnect structure with TSV using encapsulant for structural support | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Jae Hun Ku, Glenn Omandam, Kock Liang Heng +1 more | 2014-02-25 |
| 8648470 | Semiconductor device and method of forming FO-WLCSP with multiple encapsulants | Yaojian Lin, Jose Alvin Caparas, Kang Chen | 2014-02-11 |
| 8624364 | Integrated circuit packaging system with encapsulation connector and method of manufacture thereof | Seng Guan Chow, Rui Huang, Heap Hoe Kuan | 2014-01-07 |
| 8455991 | Integrated circuit packaging system with warpage control and method of manufacture thereof | Yung Kuan Hsiao, Xusheng Bao, Kang Chen, Rui Huang | 2013-06-04 |
| 8456002 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Yu Gu, Il Kwon Shim +4 more | 2013-06-04 |
| 8421212 | Integrated circuit packaging system with active surface heat removal and method of manufacture thereof | Kang Chen, Xusheng Bao, Rui Huang, Yung Kuan Hsiao | 2013-04-16 |
| 8405230 | Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof | Jae Soo Lee, Geun Sik Kim, Sheila Marie L. Alvarez, Robinson Quiazon, Frederick R. Dahilig | 2013-03-26 |
| 8309451 | Semiconductor device and method of providing common voltage bus and wire bondable redistribution | Byung Tai Do, Stephen A. Murphy, Yaojian Lin, Heap Hoe Kuan, Pandi C. Marimuthu | 2012-11-13 |
| 8304880 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | Seng Guan Chow, Rui Huang, Heap Hoe Kuan | 2012-11-06 |
| 8067308 | Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Jae Hun Ku, Glenn Omandam, Kock Liang Heng +1 more | 2011-11-29 |