Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10649619 | System and method of using context in selecting a response to user device interaction | Christopher Man-kit Chan, Maud Calegari, Lu Ding, Maurice Rotta, Peter Levinson | 2020-05-12 |
| 9711438 | Semiconductor device and method of forming a dual UBM structure for lead free bump connections | Li-Jen Lin, Wei-Chung Sun | 2017-07-18 |
| 8759209 | Semiconductor device and method of forming a dual UBM structure for lead free bump connections | Li-Jen Lin, Wei-Chung Sun | 2014-06-24 |
| 8309451 | Semiconductor device and method of providing common voltage bus and wire bondable redistribution | Byung Tai Do, Yaojian Lin, Heap Hoe Kuan, Pandi C. Marimuthu, Hin Hwa Goh | 2012-11-13 |
| 5998242 | Vacuum assisted underfill process and apparatus for semiconductor package fabrication | Galen Kirkpatrick, Manickam Thavarajah, Sunil A. Patel | 1999-12-07 |