WS

Wei-Chung Sun

TSMC: 9 patents #2,978 of 12,232Top 25%
SC Stats Chippac: 2 patents #282 of 425Top 70%
UM United Microelectronics: 1 patents #2,686 of 4,560Top 60%
Overall (All Time): #398,843 of 4,157,543Top 10%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
12402367 Semiconductor structure and manufacturing method thereof Kuang-Hsiu Chen, Chao-Nan Chen, Chun-Wei Yu, Kuan Hsuan Ku, Shao-Wei Wang 2025-08-26
12402402 Transistor gate profile optimization Chi-Sheng Lai, Li Chen, Kuei-Yu Kao, Chih-Han Lin 2025-08-26
12362285 Alignment structure for semiconductor device and method of forming same Chi-Sheng Lai, Li Chen, Kuei-Yu Kao, Chih-Han Lin 2025-07-15
12166096 Semiconductor device structure with uneven gate profile Chi-Sheng Lai, Yu-Fan Peng, Li Chen, Yu-Shan Lu, Yu-Bey Wu +6 more 2024-12-10
11652003 Gate formation process Chi-Sheng Lai, Li Chen, Kuei-Yu Kao, Chih-Han Lin 2023-05-16
11631745 Semiconductor device structure with uneven gate profile Chi-Sheng Lai, Yu-Fan Peng, Li Chen, Yu-Shan Lu, Yu-Bey Wu +6 more 2023-04-18
11557590 Transistor gate profile optimization Chi-Sheng Lai, Li Chen, Kuei-Yu Kao, Chih-Han Lin 2023-01-17
11393769 Alignment structure for semiconductor device and method of forming same Chi-Sheng Lai, Li Chen, Kuei-Yu Kao, Chih-Han Lin 2022-07-19
11264282 Gate formation process Chi-Sheng Lai, Li Chen, Kuei-Yu Kao, Chih-Han Lin 2022-03-01
11205647 Semiconductor device and method of manufacture Shih-Yao Lin, Kuei-Yu Kao, Chi-Sheng Lai, Chih-Han Lin, Ming-Ching Chang +1 more 2021-12-21
9711438 Semiconductor device and method of forming a dual UBM structure for lead free bump connections Li-Jen Lin, Stephen A. Murphy 2017-07-18
8759209 Semiconductor device and method of forming a dual UBM structure for lead free bump connections Li-Jen Lin, Stephen A. Murphy 2014-06-24