Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device and method of forming a dual UBM structure for lead free bump connections

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

US Patent 9711438 · Granted Jul 18, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor structure and manufacturing method thereof2025
Transistor gate profile optimization2025
Alignment structure for semiconductor device and method of forming same2025
Semiconductor device structure with uneven gate profile2024
Gate formation process2023
Semiconductor device structure with uneven gate profile2023
Transistor gate profile optimization2023
Alignment structure for semiconductor device and method of forming same2022
Gate formation process2022
Semiconductor device and method of manufacture2021
System and method of using context in selecting a response to user device intera2020
Semiconductor device and method of forming a dual UBM structure for lead free bu2014