Issued Patents All Time
Showing 25 most recent of 228 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE48408 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seng Guan Chow, Seung Uk Yoon, Linda Pei Ee Chua | 2021-01-26 |
| RE48111 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seng Guan Chow, Seung Uk Yoon, Linda Pei Ee Chua | 2020-07-21 |
| 10388584 | Semiconductor device and method of forming Fo-WLCSP with recessed interconnect area in peripheral region of semiconductor die | Reza A. Pagaila, Linda Pei Ee Chua | 2019-08-20 |
| 10109587 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Kyung-Moon Kim, Jeffrey D. Punzalan, SeungYong Chai +3 more | 2018-10-23 |
| 10068862 | Semiconductor device and method of forming a package in-fan out package | Arnel Senosa Trasporto | 2018-09-04 |
| 10043733 | Integrated circuit packaging system and method of manufacture thereof | Reza A. Pagaila, Linda Pei Ee Chua | 2018-08-07 |
| 9893045 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seng Guan Chow, Seung Uk Yoon, Linda Pei Ee Chua | 2018-02-13 |
| 9847253 | Package-on-package using through-hole via die on saw streets | Heap Hoe Kuan, Seng Guan Chow | 2017-12-19 |
| 9824975 | Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die | Reza A. Pagaila, Linda Pei Ee Chua | 2017-11-21 |
| 9799589 | Integrated circuit packaging system with a grid array with a leadframe and method of manufacture thereof | Arnel Senosa Trasporto, Linda Pei Ee Chua | 2017-10-24 |
| 9679881 | Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill material | Reza A. Pagaila, Linda Pei Ee Chua | 2017-06-13 |
| 9640504 | Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core | Reza A. Pagaila, Shuangwu Huang | 2017-05-02 |
| 9620480 | Integrated circuit packaging system with unplated leadframe and method of manufacture thereof | Garret Dimaculangan, Linda Pei Ee Chua, Arnel Senosa Trasporto | 2017-04-11 |
| 9601369 | Semiconductor device and method of forming conductive vias with trench in saw street | Reza A. Pagaila | 2017-03-21 |
| 9583446 | Semiconductor device and method of forming a shielding layer between stacked semiconductor die | Reza A. Pagaila, Nathapong Suthiwongsunthorn | 2017-02-28 |
| 9576873 | Integrated circuit packaging system with routable trace and method of manufacture thereof | Arnel Senosa Trasporto, Linda Pei Ee Chua | 2017-02-21 |
| 9530738 | Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant | Linda Pei Ee Chua, Reza A. Pagaila | 2016-12-27 |
| 9524938 | Package-in-package using through-hole via die on saw streets | Heap Hoe Kuan, Seng Guan Chow | 2016-12-20 |
| 9449932 | Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die | Arnel Senosa Trasporto, Linda Pei Ee Chua, Reza A. Pagaila | 2016-09-20 |
| 9443828 | Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation | Reza A. Pagaila, Linda Pei Ee Chua | 2016-09-13 |
| 9431331 | Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure | Reza A. Pagaila, Linda Pei Ee Chua | 2016-08-30 |
| 9418941 | Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP | Reza A. Pagaila | 2016-08-16 |
| 9412624 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Kyung-Moon Kim, Jeffrey D. Punzalan, SeungYong Chai +3 more | 2016-08-09 |
| 9406647 | Extended redistribution layers bumped wafer | Heap Hoe Kuan | 2016-08-02 |
| 9406619 | Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die | Reza A. Pagaila, Dioscoro A. Merilo | 2016-08-02 |