Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11256496 | Apparatus and method for managing application | Myeong Jin Oh, Moon-kyung Kim, Jae-Young Lee | 2022-02-22 |
| 10678527 | Apparatus and method for managing application | Myeong Jin Oh, Moon-kyung Kim, Jae-Young Lee | 2020-06-09 |
| 10109587 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Byung Tai Do, Jeffrey D. Punzalan, SeungYong Chai +3 more | 2018-10-23 |
| 9865554 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Il Kwon Shim, HeeJo Chi, JunMo Koo, Bartholomew Liao Chung Foh, Zigmund Ramirez Camacho | 2018-01-09 |
| 9748157 | Integrated circuit packaging system with joint assembly and method of manufacture thereof | HeeJo Chi, HanGil Shin, NamJu Cho | 2017-08-29 |
| 9412624 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Byung Tai Do, Jeffrey D. Punzalan, SeungYong Chai +3 more | 2016-08-09 |
| 9312150 | Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package | Nazir Ahmad, Young Do Kweon, Samuel Tam, Rajendra D. Pendse | 2016-04-12 |
| 9299650 | Integrated circuit packaging system with single metal layer interposer and method of manufacture thereof | HeeJo Chi, HanGil Shin, NamJu Cho | 2016-03-29 |
| 9202793 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Il Kwon Shim, HeeJo Chi, JunMo Koo, Bartholomew Liao, Zigmund Ramirez Camacho | 2015-12-01 |
| 8951834 | Methods of forming solder balls in semiconductor packages | Il Kwon Shim, HeeJo Chi, HanGil Shin | 2015-02-10 |
| 8604624 | Flip chip interconnection system having solder position control mechanism | Oh Han Kim | 2013-12-10 |
| 8124520 | Integrated circuit mount system with solder mask pad | KyungOe Kim, Haengcheol Choi, Rajendra D. Pendse | 2012-02-28 |
| 8119450 | Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots | Nazir Ahmad, Young Do Kweon, Samuel Tam, Rajendra D. Pendse | 2012-02-21 |
| 7736950 | Flip chip interconnection | Rajendra D. Pendse, Marcos Karnezos, Koo Hong Lee, Moon Hee Lee, Orion K. Starr | 2010-06-15 |
| 7407877 | Self-coplanarity bumping shape for flip-chip | Young Do Kweon, Rajendra D. Pendse, Nazir Ahmad | 2008-08-05 |
| 7211901 | Self-coplanarity bumping shape for flip chip | Young Do Kweon, Rajendra D. Pendse, Nazir Ahmad | 2007-05-01 |
| 6940178 | Self-coplanarity bumping shape for flip chip | Young Do Kweon, Rajendra D. Pendse, Nazir Ahmad | 2005-09-06 |
| 6737295 | Chip scale package with flip chip interconnect | Rajendra D. Pendse, Nazir Ahmad, Andrea Chen, Young Do Kweon, Samuel Tam | 2004-05-18 |