NA

Nazir Ahmad

CH Chippac: 4 patents #8 of 42Top 20%
JA Jabil: 2 patents #82 of 170Top 50%
PI Pinnacle Research Institute: 2 patents #9 of 15Top 60%
SC Stats Chippac: 2 patents #228 of 425Top 55%
JC Jabil Circuit: 1 patents #35 of 56Top 65%
BC Beijing Apollo Ding Rong Solar Technology Co.: 1 patents #35 of 51Top 70%
AL Apollo Precision Kunming Yuanhong Limited: 1 patents #3 of 22Top 15%
LP Lenovo (Singapore) Pte.: 1 patents #697 of 1,301Top 55%
Overall (All Time): #319,771 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10769775 System, apparatus and method for dispensed adhesive material inspection Quyen Duc Chu 2020-09-08
10204408 System, apparatus and method for dispensed adhesive material inspection Quyen Duc Chu 2019-02-12
9935225 Electrical connectors of building integrable photovoltaic modules Jason Stephen Corneille, Michael Meyers, Adam C. Sherman 2018-04-03
9626754 System, apparatus and method for dispensed adhesive material inspection Quyen Duc Chu 2017-04-18
9312150 Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package Young Do Kweon, Samuel Tam, Kyung-Moon Kim, Rajendra D. Pendse 2016-04-12
9112080 Electrical connectors of building integrable photovoltaic modules Jason Stephen Corneille, Michael Meyers, Adam C. Sherman 2015-08-18
8119450 Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots Young Do Kweon, Samuel Tam, Kyung-Moon Kim, Rajendra D. Pendse 2012-02-21
7407877 Self-coplanarity bumping shape for flip-chip Young Do Kweon, Rajendra D. Pendse, Kyung-Moon Kim 2008-08-05
7211901 Self-coplanarity bumping shape for flip chip Young Do Kweon, Rajendra D. Pendse, Kyung-Moon Kim 2007-05-01
7107487 Fault tolerant sleep mode of operation Ameha Aklilu, Jordan Hsiao Ping Chin, Richard A. Dayan, James Hoff, Eric R. Kern 2006-09-12
6940178 Self-coplanarity bumping shape for flip chip Young Do Kweon, Rajendra D. Pendse, Kyung-Moon Kim 2005-09-06
6737295 Chip scale package with flip chip interconnect Rajendra D. Pendse, Andrea Chen, Kyung-Moon Kim, Young Do Kweon, Samuel Tam 2004-05-18
6514296 Method of making energy storage device having electrodes coated with insulating microprotrusions K. C. Tsai, Gary E. Mason, Mark L. Goodwin, Davy Wu, Douglas Cromack +5 more 2003-02-04
5867363 Energy storage device K. C. Tsai, Gary E. Mason, Mark L. Goodwin, Davy Wu, Douglas Cromack +5 more 1999-02-02
5800857 Energy storage device and methods of manufacture Keh-Chi Tsai 1998-09-01