Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12316929 | Camera module on flexible interconnect tape | — | 2025-05-27 |
| 12149803 | Camera module with a folded flexible interconnect tape package | — | 2024-11-19 |
| 10925160 | Electronic device with a display assembly and silicon circuit board substrate | Jasmin B. Farshi | 2021-02-16 |
| 10069018 | Camera assembly with embedded components and redistribution layer interconnects | Tak Shing Pang | 2018-09-04 |
| 9848111 | Imager module with molded packaging | Tak Shing Pang | 2017-12-19 |
| 9838599 | Multiple camera alignment system with rigid substrates | Tak Shing Pang, Wei Li | 2017-12-05 |
| 9838600 | Multiple camera alignment system with flexible substrates and stiffener members | Tak Shing Pang, Wei Li | 2017-12-05 |
| 9793316 | Imager module with interposer chip | — | 2017-10-17 |
| 9748460 | LED back end assembly and method of manufacturing | Murad Kurwa, Shing Dick Pang Tak | 2017-08-29 |
| 9706092 | Imager module with castellated interposer chip | Tak Shing Pang | 2017-07-11 |
| 9681032 | Imager module with molded packaging | Tak Shing Pang | 2017-06-13 |
| 9514925 | Protective coating for silicon substrate | Tak Shing Pang | 2016-12-06 |
| 9419032 | Wafer level camera module with molded housing and method of manufacturing | Harpuneet Singh, Dongkai Shangguan | 2016-08-16 |
| 9312150 | Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package | Nazir Ahmad, Young Do Kweon, Kyung-Moon Kim, Rajendra D. Pendse | 2016-04-12 |
| 9276140 | Imager module with interposer chip | — | 2016-03-01 |
| 9241097 | Camera module including image sensor die in molded cavity substrate | — | 2016-01-19 |
| 9204025 | Camera module with a molded enclosure contained in a flexible substrate | — | 2015-12-01 |
| 9178093 | Solar cell module on molded lead-frame and method of manufacture | Tai Wai Pun, Tak Shing Pang | 2015-11-03 |
| 9167161 | Camera module package with a folded substrate and laterally positioned components | — | 2015-10-20 |
| 9136289 | Camera module housing having built-in conductive traces to accommodate stacked dies using flip chip connections | — | 2015-09-15 |
| 9088705 | Camera module package with stiffener-mounted image sensor die | — | 2015-07-21 |
| 9041019 | Method of and device for manufacturing LED assembly using liquid molding technologies | Murad Kurwa, Dick Pang | 2015-05-26 |
| 9018749 | Stacked packages using laser direct structuring | Bryan Lee Sik Pong, Dick Pang | 2015-04-28 |
| 8913180 | Folded tape package for electronic devices | — | 2014-12-16 |
| 8642387 | Method of fabricating stacked packages using laser direct structuring | Bryan Lee Sik Pong, Dick Pang | 2014-02-04 |