Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
ST

Samuel Tam — 34 Patents

Amazon: 14 patents #969 of 19,158Top 6%
FAFlextronics Ap: 11 patents #14 of 385Top 4%
Meta: 2 patents #2,918 of 6,845Top 45%
SCStats Chippac: 2 patents #279 of 425Top 70%
FUFlextronics International Usa: 2 patents #15 of 45Top 35%
NTNan Chang O-Film Optoelectronics Technology: 1 patents #12 of 42Top 30%
DIDigitaloptics: 1 patents #51 of 112Top 50%
CHChippac: 1 patents #23 of 42Top 55%
Daly City, CA: #10 of 482 inventorsTop 3%
California: #14,619 of 386,348 inventorsTop 4%
Overall (All Time): #100,737 of 4,157,543Top 3%
34 Patents All Time
Samuel Tam has been granted 34 US patents while listed as an inventor at Amazon. The first was granted in 2004 and the most recent in May 2025. Samuel Tam ranks #100,737 of 4,157,543 US inventors in our database (top 2.4%). Patent records list Samuel Tam in Daly City, CA, US.

Issued Patents All Time

Showing 1–25 of 34 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12316929 Camera module on flexible interconnect tape 2025-05-27
12149803 Camera module with a folded flexible interconnect tape package 2024-11-19 $849,182,000
10925160 Electronic device with a display assembly and silicon circuit board substrate Jasmin B. Farshi 2021-02-16 $236,940,000
10069018 Camera assembly with embedded components and redistribution layer interconnects Tak Shing Pang 2018-09-04 $97,614,000
9848111 Imager module with molded packaging Tak Shing Pang 2017-12-19 $123,160,000
9838599 Multiple camera alignment system with rigid substrates Tak Shing Pang, Wei Li 2017-12-05 $70,058,000
9838600 Multiple camera alignment system with flexible substrates and stiffener members Tak Shing Pang, Wei Li 2017-12-05 $70,058,000
9793316 Imager module with interposer chip 2017-10-17 $37,690,000
9748460 LED back end assembly and method of manufacturing Murad Kurwa, Shing Dick Pang Tak 2017-08-29
9706092 Imager module with castellated interposer chip Tak Shing Pang 2017-07-11 $34,852,000
9681032 Imager module with molded packaging Tak Shing Pang 2017-06-13 $53,479,000
9514925 Protective coating for silicon substrate Tak Shing Pang 2016-12-06 $57,115,000
9419032 Wafer level camera module with molded housing and method of manufacturing Harpuneet Singh, Dongkai Shangguan 2016-08-16
9312150 Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package Nazir Ahmad, Young Do Kweon, Kyung-Moon Kim, Rajendra D. Pendse 2016-04-12
9276140 Imager module with interposer chip 2016-03-01 $48,892,000
9241097 Camera module including image sensor die in molded cavity substrate 2016-01-19 $76,302,000
9204025 Camera module with a molded enclosure contained in a flexible substrate 2015-12-01 $81,962,000
9178093 Solar cell module on molded lead-frame and method of manufacture Tai Wai Pun, Tak Shing Pang 2015-11-03
9167161 Camera module package with a folded substrate and laterally positioned components 2015-10-20 $65,501,000
9136289 Camera module housing having built-in conductive traces to accommodate stacked dies using flip chip connections 2015-09-15
9088705 Camera module package with stiffener-mounted image sensor die 2015-07-21 $59,589,000
9041019 Method of and device for manufacturing LED assembly using liquid molding technologies Murad Kurwa, Dick Pang 2015-05-26
9018749 Stacked packages using laser direct structuring Bryan Lee Sik Pong, Dick Pang 2015-04-28
8913180 Folded tape package for electronic devices 2014-12-16
8642387 Method of fabricating stacked packages using laser direct structuring Bryan Lee Sik Pong, Dick Pang 2014-02-04