Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8477239 | Integrated lens and chip assembly for a digital camera | Vidyadhar Kale, Dongkai Shangguan | 2013-07-02 |
| 8430579 | Camera module with molded tape flip chip imager mount and method of manufacture | Tai Wai Pun, Tak Shing Pang | 2013-04-30 |
| 8385073 | Folded system-in-package with heat spreader | Younes Shabany | 2013-02-26 |
| 8119450 | Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots | Nazir Ahmad, Young Do Kweon, Kyung-Moon Kim, Rajendra D. Pendse | 2012-02-21 |
| 8092102 | Camera module with premolded lens housing and method of manufacture | Dongkai Shangguan | 2012-01-10 |
| 7872686 | Integrated lens and chip assembly for a digital camera | Vidyadhar Kale, Dongkai Shangguan | 2011-01-18 |
| 7796187 | Wafer based camera module and method of manufacture | Dongkai Shangguan, Vidyadhar Kale | 2010-09-14 |
| 7684689 | External adjustment mechanism for a camera lens and electronic imager | Dongkai Shangguan, Elaine B. Bogue, Vidyadhar Kale, Ray H. Morton | 2010-03-23 |
| 6737295 | Chip scale package with flip chip interconnect | Rajendra D. Pendse, Nazir Ahmad, Andrea Chen, Kyung-Moon Kim, Young Do Kweon | 2004-05-18 |