Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243850 | Devices, systems, and methods for stacked die packages | Cheng Yang | 2025-03-04 |
| 12156356 | Electronic encapsulation through stencil printing | Weifeng Liu, Jesus Tan, William L. Uy | 2024-11-26 |
| 11723151 | Methods of creating exposed cavities in molded electronic devices | David Geiger, Venkat Iyer, Cheng Yang | 2023-08-08 |
| 11682603 | Control of thermal interface material in multi-chip package | Cheng Yang | 2023-06-20 |
| 11493414 | Testing system for flexible sample in electronics having a retractable holder configured to conform a sample by a mandrel | Weifeng Liu, Jesus Tan, William L. Uy | 2022-11-08 |
| 11470717 | Stress relief encapsulation for flexible hybrid electronics | Weifeng Liu, William L. Uy | 2022-10-11 |
| 11304302 | Methods of creating exposed cavities in molded electronic devices | David Geiger, Venkat Iyer, Cheng Yang | 2022-04-12 |
| 11289393 | Methods, devices, and systems for electronic device molding and encapsulation | Weifeng Liu, Jesus Tan, William L. Uy | 2022-03-29 |
| 11270974 | Embedded copper structure for microelectronics package | Cheng Yang, Li Yao | 2022-03-08 |
| 11064613 | Electronics encapsulation through hotmelt lamination | Weifeng Liu, William L. Uy | 2021-07-13 |
| 10999926 | Stress relief encapsulation for flexible hybrid electronics | Weifeng Liu, William L. Uy | 2021-05-04 |
| 10896877 | System in package with double side mounted board | Cheng Yang, Bo Li, Venkat Iyer | 2021-01-19 |
| 10653010 | Connection of multilayer printed conductive ink through filled microvias | Weifeng Liu, William L. Uy, Alex Chan | 2020-05-12 |
| 9773684 | Method of manufacturing fan out wafer level package | Hongjie Wang, Yibo Liu, Feng Chen, Peng SUN | 2017-09-26 |
| 9419032 | Wafer level camera module with molded housing and method of manufacturing | Harpuneet Singh, Samuel Tam | 2016-08-16 |
| 8477239 | Integrated lens and chip assembly for a digital camera | Vidyadhar Kale, Samuel Tam | 2013-07-02 |
| 8092102 | Camera module with premolded lens housing and method of manufacture | Samuel Tam | 2012-01-10 |
| 7872686 | Integrated lens and chip assembly for a digital camera | Vidyadhar Kale, Samuel Tam | 2011-01-18 |
| 7796187 | Wafer based camera module and method of manufacture | Vidyadhar Kale, Samuel Tam | 2010-09-14 |
| 7684689 | External adjustment mechanism for a camera lens and electronic imager | Elaine B. Bogue, Vidyadhar Kale, Samuel Tam, Ray H. Morton | 2010-03-23 |
| 6476332 | Conductor systems for thick film electronic circuits | — | 2002-11-05 |
| 6416597 | Solder composition and a method for making the same | Robert John Gordon | 2002-07-09 |
| 6360939 | Lead-free electrical solder and method of manufacturing | Mohan R. Paruchuri | 2002-03-26 |
| 6250541 | Method of forming interconnections on electronic modules | Mohan R. Paruchuri, Achyuta Achari | 2001-06-26 |
| 6082610 | Method of forming interconnections on electronic modules | Mohan R. Paruchuri, Achyuta Achari | 2000-07-04 |