Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6027575 | Metallic adhesive for forming electronic interconnects at low temperatures | Mohan R. Paruchuri | 2000-02-22 |
| 6011313 | Flip chip interconnections on electronic modules | Mohan R. Paruchuri, Achyuta Achari | 2000-01-04 |
| 5996222 | Soldering process with minimal thermal impact on substrate | Myron Lemecha, Achyuta Achari | 1999-12-07 |
| 5928404 | Electrical solder and method of manufacturing | Mohan R. Paruchuri | 1999-07-27 |
| 5894054 | Aluminum components coated with zinc-antimony alloy for manufacturing assemblies by CAB brazing | Mohan R. Paruchuri | 1999-04-13 |
| 5871690 | Low-temperature solder compositions | Achyuta Achari, Mohan R. Paruchuri | 1999-02-16 |
| 5863493 | Lead-free solder compositions | Achyuta Achari, Mohan R. Paruchuri | 1999-01-26 |
| 5833921 | Lead-free, low-temperature solder compositions | Mohan R. Paruchuri | 1998-11-10 |
| 5755896 | Low temperature lead-free solder compositions | Mohan R. Paruchuri | 1998-05-26 |
| 5429689 | Lead-free solder alloys | Achyuta Achari | 1995-07-04 |