AA

Achyuta Achari

VT Visteon Global Technologies: 18 patents #21 of 1,929Top 2%
Ford: 9 patents #1,988 of 17,473Top 15%
Overall (All Time): #147,800 of 4,157,543Top 4%
27
Patents All Time

Issued Patents All Time

Showing 25 most recent of 27 patents

Patent #TitleCo-InventorsDate
7156279 System and method for mounting electronic components onto flexible substrates Lawrence Bullock, Charles F. Schweitzer, Mark D. Miller, Jay DeAvis Baker, Karen Lee Chiles +1 more 2007-01-02
6998293 Flip-chip bonding method Mohan R. Paruchuri, Raja-Sheker Bollampally 2006-02-14
6852932 Circuit board with air-bridge Andrew Z. Glovatsky, Robert Edward Belke, Brenda Joyce Nation, Delin Li, Lakhi Nandlal Goenka +3 more 2005-02-08
6810723 Engine combustion monitoring and control with integrated cylinder head gasket combustion sensor Myron Lemecha, Jay DeAvis Baker, William Hopfe, Lakhi Nandlal Goenka 2004-11-02
6729023 Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material Andrew Z. Glovatsky, Robert Edward Belke, Brenda Joyce Nation, Delin Li, Lakhi Nandlal Goenka +3 more 2004-05-04
6601292 Method for the connection and repair of flex and other circuits Delin Li, Jay DeAvis Baker, Brenda Joyce Nation, John Trublowski 2003-08-05
6555015 Multi-layer printed circuit board and method of making same Daniel Phillip Dailey, Robert Edward Belke, Jay DeAvis Baker, Myron Lemecha, Michael George Todd 2003-04-29
6528736 Multi-layer printed circuit board and method of making same Daniel Phillip Dailey, Robert Edward Belke, Jay DeAvis Baker, Myron Lemecha, Michael George Todd 2003-03-04
6475703 Method for constructing multilayer circuit boards having air bridges Delin Li, Alice Dawn Zitzmann, Robert Edward Belke, Brenda Joyce Nation, Edward McLeskey +2 more 2002-11-05
6467161 Method for making a circuit board Brenda Joyce Nation, Delin Li, Lakhi Nandlal Goenka, Richard Keith McMillan, Vivek Amir Jairazbhoy 2002-10-22
6459041 Etched tri-layer metal bonding layer Lakhi Nandlal Goenka, Mohan R. Paruchuri 2002-10-01
6454878 Cladded material construction for etched-tri-metal circuits Brenda Joyce Nation, Jay DeAvis Baker, Lakhi Nandlal Goenka, Mohan R. Paruchuri, Vladimir Stoica 2002-09-24
6403893 Circuit board and a method for making the same Andrew Z. Glovatsky, Robert Edward Belke, Brenda Joyce Nation, Delin Li, Lakhi Nandlal Goenka +2 more 2002-06-11
6307240 Pulsed etching manufacturing method and system Lakhi Nandlal Goenka 2001-10-23
6274819 Method and article for the connection and repair of flex and other circuits Delin Li, Jay DeAvis Baker, Brenda Joyce Nation, John Trublowski 2001-08-14
6270354 Multi-connectable printed circuit board Delin Li, Jay DeAvis Baker, Brenda Joyce Nation, John Trublowski 2001-08-07
6250541 Method of forming interconnections on electronic modules Dongkai Shangguan, Mohan R. Paruchuri 2001-06-26
6168725 Etching of Al-Cu layers to form electronic circuits using base solutions including nitrites, borates or bromates Mohan R. Paruchuri 2001-01-02
6082610 Method of forming interconnections on electronic modules Dongkai Shangguan, Mohan R. Paruchuri 2000-07-04
6019910 Etching tri-metal layers to form electronic circuits using aqueous alkaline solutions including nitrates Delin Li 2000-02-01
6011313 Flip chip interconnections on electronic modules Dongkai Shangguan, Mohan R. Paruchuri 2000-01-04
5996222 Soldering process with minimal thermal impact on substrate Dongkai Shangguan, Myron Lemecha 1999-12-07
5871690 Low-temperature solder compositions Mohan R. Paruchuri, Dongkai Shangguan 1999-02-16
5863493 Lead-free solder compositions Mohan R. Paruchuri, Dongkai Shangguan 1999-01-26
5429689 Lead-free solder alloys Dongkai Shangguan 1995-07-04