Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7582510 | Electronic packaging materials for use with low-k dielectric-containing semiconductor devices | James T. Huneke, Lawrence N. Crane, Gordon C. Fischer | 2009-09-01 |
| 6882058 | Organic acid containing compositions and methods for use thereof | Bruce C. B. Chan | 2005-04-19 |
| 6740246 | Circuit board and a method for making the same | Andrew Z. Glovatsky, Robert Edward Belke, Marc Straub | 2004-05-25 |
| 6555015 | Multi-layer printed circuit board and method of making same | Daniel Phillip Dailey, Robert Edward Belke, Jay DeAvis Baker, Achyuta Achari, Myron Lemecha | 2003-04-29 |
| 6528736 | Multi-layer printed circuit board and method of making same | Daniel Phillip Dailey, Robert Edward Belke, Jay DeAvis Baker, Achyuta Achari, Myron Lemecha | 2003-03-04 |
| 6326241 | Solderless flip-chip assembly and method and material for same | Robert Edward Belke, Brian John Hayden, Cuong Pham, Rosa Lynda Nuno | 2001-12-04 |
| 6197145 | Method of laminating a flexible circuit to a substrate | Rexanne M. Coyner, Andrew Z. Glovatsky, Daniel Phillip Dailey, Robert Edward Belke | 2001-03-06 |
| 6100178 | Three-dimensional electronic circuit with multiple conductor layers and method for manufacturing same | Andrew Z. Glovatsky, Peter Joseph Sinkunas | 2000-08-08 |
| 6076950 | Integrated lighting assembly | Mark Stephen Topping, Mark William Miller | 2000-06-20 |
| 5994648 | Three-dimensional molded sockets for mechanical and electrical component attachment | Andrew Z. Glovatsky, Cuong Van Pham | 1999-11-30 |
| 5986884 | Method for cooling electronic components | Vivek Amir Jairazbhoy, Prathap Amerwai Reddy | 1999-11-16 |
| 5938455 | Three-dimensional molded circuit board having interlocking connections | Andrew Z. Glovatsky, Peter Joseph Sinkunas, Myron Lemecha | 1999-08-17 |
| 5929375 | EMI protection and CTE control of three-dimensional circuitized substrates | Andrew Z. Glovatsky, Richard Keith McMillan | 1999-07-27 |
| 5925298 | Method for reworking a multi-layer circuit board using a shape memory alloy material | Bethany J. Walles, Robert Edward Belke | 1999-07-20 |
| 5914534 | Three-dimensional multi-layer molded electronic device and method for manufacturing same | Peter Joseph Sinkunas, Andrew Z. Glovatsky | 1999-06-22 |
| 5909839 | Method for dispensing solder paste on a non-planar substrate using an array of ultrasonically agitated pins | Robert Edward Belke, John Trublowski | 1999-06-08 |
| 5909012 | Method of making a three-dimensional part with buried conductors | Charles F. Schweitzer, Robert Edward Belke, Tianmin Zheng | 1999-06-01 |
| 5882954 | Method for adhering a metallization to a substrate | Ram S. Raghava, Andrew Z. Glovatsky, Jay DeAvis Baker | 1999-03-16 |
| 5878487 | Method of supporting an electrical circuit on an electrically insulative base substrate | Richard Keith McMillan, Andrew Z. Glovatsky | 1999-03-09 |
| 5837609 | Fully additive method of applying a circuit pattern to a three-dimensional, nonconductive part | Robert Edward Belke, Andrew Z. Glovatsky | 1998-11-17 |
| 5830389 | Electrically conductive compositions and methods for the preparation and use thereof | Miguel A. Capote, Nicholas J. Manesis, Hugh Craig | 1998-11-03 |
| 5783867 | Repairable flip-chip undercoating assembly and method and material for same | Robert Edward Belke, Bethany J. Walles, Brian John Hayden | 1998-07-21 |
| 5752851 | Circuit clip connector | Victor Zaderej, Andrew Z. Glovatsky, Peter Joseph Sinkunas | 1998-05-19 |
| 5738797 | Three-dimensional multi-layer circuit structure and method for forming the same | Robert Edward Belke, Andrew Z. Glovatsky, Alice Dawn Zitzmann | 1998-04-14 |
| 5715140 | Overlay substrate for securing electronic devices in a vehicle | Peter Joseph Sinkunas, Andrew Z. Glovatsky, Myron Lemecha | 1998-02-03 |