PS

Peter Joseph Sinkunas

Ford: 10 patents #1,793 of 17,473Top 15%
VT Visteon Global Technologies: 9 patents #69 of 1,929Top 4%
📍 Canton, MI: #148 of 2,230 inventorsTop 7%
🗺 Michigan: #4,032 of 86,293 inventorsTop 5%
Overall (All Time): #225,811 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #TitleCo-InventorsDate
7026582 Vector transient reflow of lead free solder for controlling substrate warpage Lakhi Nandlal Goenka, Larry N. Schmidt, Sherwin T. Moss 2006-04-11
7009142 System and method for joining flat flexible cables Zhong-You Shi 2006-03-07
6833526 Flex to flex soldering by diode laser Zhong-You Shi, Lawrence Bullock 2004-12-21
6830176 System and method for repairing flex circuits Zhong-You Shi, Jay DeAvis Baker, Robert Edward Belke, Charles F. Schweitzer, Raymond Foster +1 more 2004-12-14
6814273 Flatwire repair tool systems and methods Anne M. Sullivan, Xu Song, Lakhi Nandlal Goenka, Yutaka Kawase, Cuong Pham +1 more 2004-11-09
6753477 Flatwire jumper patch Andrew Z. Glovatsky, Xu Song, Anne M. Sullivan, Yutaka Kawase 2004-06-22
6642485 System and method for mounting electronic components onto flexible substrates Lakhi Nandlal Goenka 2003-11-04
6583385 Method for soldering surface mount components to a substrate using a laser Zhong-You Shi, Jay DeAvis Baker 2003-06-24
6284998 Method for laser soldering a three dimensional component Andrew Z. Glovatsky, Bernard A. Meyer, Zhong-You Shi, Myron Lemecha, Rexanne M. Coyner 2001-09-04
6168070 Method for soldering DPAK-type electronic components to circuit boards 2001-01-02
6100178 Three-dimensional electronic circuit with multiple conductor layers and method for manufacturing same Michael George Todd, Andrew Z. Glovatsky 2000-08-08
5938455 Three-dimensional molded circuit board having interlocking connections Andrew Z. Glovatsky, Michael George Todd, Myron Lemecha 1999-08-17
5920462 Heat spreader mounting pad configurations for laser soldering Andrew Z. Glovatsky, Jay DeAvis Baker 1999-07-06
5914534 Three-dimensional multi-layer molded electronic device and method for manufacturing same Michael George Todd, Andrew Z. Glovatsky 1999-06-22
5794836 Inert gas air horn distribution device Jeff Lin, Myron Lemecha, Stephen H. P. Wong 1998-08-18
5752851 Circuit clip connector Victor Zaderej, Michael George Todd, Andrew Z. Glovatsky 1998-05-19
5715140 Overlay substrate for securing electronic devices in a vehicle Andrew Z. Glovatsky, Michael George Todd, Myron Lemecha 1998-02-03
5706170 Ventilation duct with integrated electronics enclosure Andrew Z. Glovatsky, Michael George Todd 1998-01-06
5514414 Solvent-less vapor deposition apparatus and process for application of soldering fluxes Guilian Gao, Brenda Joyce Nation, Myron Lemecha, Lawrence Kneisel 1996-05-07
4942997 Solder flow well for reflowing solder of multipin components Rodney L. Ritter, James E. Altpeter 1990-07-24