Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7372176 | Bulkhead flatwire integration units | Myron Lemecha, Andrew Z. Glovatsky | 2008-05-13 |
| 7070229 | Underhood electronic interior integration | Andrew Z. Glovatsky, Jay DeAvis Baker, Myron Lemecha | 2006-07-04 |
| 7048423 | Integrated light and accessory assembly | Walter Kuzma Stepanenko, Jay DeAvis Baker, Richard Keith McMillan, Brenda Joyce Nation, Cindy Maria Rutyna +2 more | 2006-05-23 |
| 7024067 | Communication system with a signal conduction matrix and surface signal router | Jay DeAvis Baker, Zhong-You Shi | 2006-04-04 |
| 7015869 | High frequency antenna disposed on the surface of a three dimensional substrate | C. Allen Marlow, Jay DeAvis Baker, Rosa Lynda Nuno, William Hopfe | 2006-03-21 |
| 6906679 | Light weight portable phased array antenna | Jay DeAvis Baker, Bernard A. Meyer, Andrew Z. Glovatsky | 2005-06-14 |
| 6838623 | Electrical circuit board and a method for making the same | Mohan R. Paruchuri, Vivek Jairazboy, Vladimir Stoica | 2005-01-04 |
| 6821003 | Vehicle lamp and vehicle illumination and data transmission system incorporating same | Jay DeAvis Baker, Paul Zoratti, Jimmy Attard, Andrew Z. Glovatsky | 2004-11-23 |
| 6807060 | Underhood electronic integration | Andrew Z. Glovatsky, Myron Lemecha, Brenda Joyce Nation | 2004-10-19 |
| 6772733 | Optically controlled IPCS circuitry | Zhong-You Shi, Bernard A. Meyer, Harvinder Singh, Jay DeAvis Baker, Richard Keith McMillan +1 more | 2004-08-10 |
| 6611429 | Electronic circuit to MG beam grounding method | Daniel Lewis Kline, Hong Zhou, Karen Lee Chiles, Mohan R. Paruchuri, Puqiang Zhang | 2003-08-26 |
| 6601753 | Void-free die attachment method with low melting metal | Jay DeAvis Baker, Mohan R. Paruchuri, Prathap Amervai Reddy, Vivek Amir Jairazbhoy | 2003-08-05 |
| 6495053 | Electrical circuit board and a method for making the same | Mohan R. Paruchuri, Vivek Amir Jalrazbhoy, Vladimir Stoica | 2002-12-17 |
| 6320128 | Environmentally-sealed electronic assembly and method of making same | Andrew Z. Glovatsky, Brenda Joyce Nation, Charles F. Schweitzer, Daniel Phillip Dailey, Delin Li +3 more | 2001-11-20 |
| 6152281 | Magnetic bulk feeder for electronic components | Michael J. Bednarz, Jay DeAvis Baker, Hsin-Hong Huang | 2000-11-28 |
| 5712764 | Apparatus and method of assembling vehicle instrument panel structural and electronic components | Jay DeAvis Baker, Myron Lemecha | 1998-01-27 |
| 5669813 | Apparatus for storing and cooling electronic devices and/or modules in a vehicle | Vivek Amir Jairazbhoy, Prathap Amerwai Reddy, John Trublowski, Jay DeAvis Baker | 1997-09-23 |
| 5545073 | Silicon micromachined CO.sub.2 cleaning nozzle and method | Jay DeAvis Baker, Lakhi Nandlal Goenka | 1996-08-13 |
| 5514414 | Solvent-less vapor deposition apparatus and process for application of soldering fluxes | Guilian Gao, Peter Joseph Sinkunas, Brenda Joyce Nation, Myron Lemecha | 1996-05-07 |
| 5510721 | Method and adjustment for known good die testing using resilient conductive straps | Bethany J. Walles, Cuong Pham, Brian John Hayden | 1996-04-23 |