Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6992887 | Liquid cooled semiconductor device | Vivek Amir Jairazbhoy, John Trublowski | 2006-01-31 |
| 6914357 | Electric machine with integrated power electronics | Ben A. Tabatowski-Bush, James P. Grzybowski, John Trublowski, Vivek Amir Jairazbhoy | 2005-07-05 |
| 6601296 | Multi-shot injection molding process for making electrical connectors and three-dimensional circuits | Daniel Phillip Dailey, Mohan R. Paruchuri | 2003-08-05 |
| 6357414 | Air manifold mounting for engine control circuitry | Pawel Kalinowski, Bharat Patel, Timothy J. Yerdon, John Trublowski, Harvinder Singh | 2002-03-19 |
| 6274407 | Method and article for attaching high-operating-temperature electronic component | Jay DeAvis Baker, Mohan R. Paruchuri, Vivek Amir Jairazbhoy | 2001-08-14 |
| 6144104 | High-operating-temperature electronic component | Jay DeAvis Baker, Mohan R. Paruchuri, Vivek Amir Jairazbhoy | 2000-11-07 |
| 6126459 | Substrate and electrical connector assembly | Cuong Pham, Brian John Hayden, Daniel E. Farnstrom | 2000-10-03 |
| 6059020 | Apparatus for acoustic cooling automotive electronics | Vivek Amir Jairazbhoy, George Mozurkewich | 2000-05-09 |
| 5986884 | Method for cooling electronic components | Vivek Amir Jairazbhoy, Michael George Todd | 1999-11-16 |
| 5792677 | Embedded metal planes for thermal management | Vivek Amir Jairazbhoy, Robert Edward Belke | 1998-08-11 |
| 5669813 | Apparatus for storing and cooling electronic devices and/or modules in a vehicle | Vivek Amir Jairazbhoy, John Trublowski, Jay DeAvis Baker, Lawrence Kneisel | 1997-09-23 |
| 5473511 | Printed circuit board with high heat dissipation | Kenneth A. Salisbury, Jay DeAvis Baker | 1995-12-05 |
| 5469329 | Printed circuit board with bi-metallic heat spreader | Jay DeAvis Baker, Larry L. Kneisel | 1995-11-21 |