Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230226 | Power dissipation for full area local dimming (FALD) display | Paul Fredrick Luther Weindorf, Danail Krasimirov Totev | 2025-02-18 |
| 11698554 | Display system | Andrew F. Rice, Paul Fredrick Luther Weindorf | 2023-07-11 |
| 11256117 | Electro-optical reflection systems | Paul Frederick Luther Weindorf, Qais Sharif, Elijah Auger | 2022-02-22 |
| 10598927 | Detecting polarization of a viewer's eyewear | Paul Fredrick Luther Weindorf, Kong Pheng Lor | 2020-03-24 |
| 10288968 | Electronic display with multiple polarizer layers | Paul Fredrick Luther Weindorf, Qais Sharif | 2019-05-14 |
| 9568655 | Backlight assembly | Adam Zysnarski, Matthew Ritthaler | 2017-02-14 |
| 7341655 | Process for improving an electrode | Michael Waite, Philip Tucker | 2008-03-11 |
| 6326241 | Solderless flip-chip assembly and method and material for same | Robert Edward Belke, Cuong Pham, Rosa Lynda Nuno, Michael George Todd | 2001-12-04 |
| 6126459 | Substrate and electrical connector assembly | Prathap Amerwai Reddy, Cuong Pham, Daniel E. Farnstrom | 2000-10-03 |
| 6019271 | Method for ultrasonic bonding flexible circuits | Cuong Pham, Rosa Lynda Nuno, Mark Stephen Topping | 2000-02-01 |
| 5921460 | Method of soldering materials supported on low-melting substrates | Mark Stephen Topping, Cuong Pham | 1999-07-13 |
| 5783867 | Repairable flip-chip undercoating assembly and method and material for same | Robert Edward Belke, Bethany J. Walles, Michael George Todd | 1998-07-21 |
| 5732873 | Magnetic energy monitor for an ultrasonic wirebonder | Mark Stephen Topping, Cuong Pham | 1998-03-31 |
| 5669545 | Ultrasonic flip chip bonding process and apparatus | C. V. Pham, Bethany J. Walles | 1997-09-23 |
| 5655700 | Ultrasonic flip chip bonding process and apparatus | Cuong Pham, Bethany J. Walles | 1997-08-12 |
| 5598096 | Method and apparatus for testing an integrated circuit using controlled wirebonding and wirebonding removal | Cuong Pham, Bethany J. Walles, Peter R. Cibirka | 1997-01-28 |
| 5510721 | Method and adjustment for known good die testing using resilient conductive straps | Bethany J. Walles, Cuong Pham, Lawrence Kneisel | 1996-04-23 |
| 5427301 | Ultrasonic flip chip process and apparatus | Cuong Pham, Bethany J. Walles | 1995-06-27 |
| 5275058 | Method and apparatus for detecting wire bond pull test failure modes | Cuong Pham | 1994-01-04 |