Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5669545 | Ultrasonic flip chip bonding process and apparatus | Brian John Hayden, Bethany J. Walles | 1997-09-23 |
CP
C. V. Pham
Overall (All Time): #3,725,240 of 4,157,543Top 90%
1
Patents All Time