Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8710682 | Materials and methods for stress reduction in semiconductor wafer passivation layers | Stephen M. Dershem, Farhad G. Mizori | 2014-04-29 |
| 8415812 | Materials and methods for stress reduction in semiconductor wafer passivation layers | Stephen M. Dershem, Farhad G. Mizori | 2013-04-09 |
| 8399974 | Methods of dicing stacked shingled strip constructions to form stacked die packages | — | 2013-03-19 |
| 7582510 | Electronic packaging materials for use with low-k dielectric-containing semiconductor devices | Michael George Todd, Lawrence N. Crane, Gordon C. Fischer | 2009-09-01 |
| 7550825 | Interlayer dielectric and pre-applied die attach adhesive materials | Benedicto delos Santos, Puwei Liu, Kang Yang, Qing Ji | 2009-06-23 |
| 7312534 | Interlayer dielectric and pre-applied die attach adhesive materials | Benedicto delos Santos, Puwei Liu, Kang Yang, Qing Ji | 2007-12-25 |
| 4574031 | Additive processing electroless metal plating using aqueous photoresist | John K. Dorey, II, Bruce S. Madsen, Theodore F. Schaaf | 1986-03-04 |
| 4374869 | Selective metal etch technique | John K. Dorey II | 1983-02-22 |