Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11174419 | Light stable transparent adhesive compositions and methods for use thereof | Jiangbo Ouyang, ChunHua Gu | 2021-11-16 |
| 10189121 | Organic acid-or latent organic acid-functionalized polymer-coated metal powders for solder pastes | — | 2019-01-29 |
| 9682447 | Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes | — | 2017-06-20 |
| 9427829 | Di- or poly-functional electron deficient olefins coated metal powders for solder paste | Barry N. Burns, Matthew J. Holloway, Blake Olsen, Edward Ho, John P. Killoran, Jr. | 2016-08-30 |
| 8835574 | Adhesive compositions for use in die attach applications | My N. Nguyen, Tadashi Takano | 2014-09-16 |
| 8698320 | Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices | My N. Nguyen | 2014-04-15 |
| 8486498 | Thermally decomposable polymer coated metal powders | Matthew J. Holloway, Blake Olsen | 2013-07-16 |
| 8338536 | Adhesive compositions for use in die attach applications | My N. Nguyen, Tadashi Takano | 2012-12-25 |
| 8278396 | Curing agents for epoxy resins | Pukun Zhu | 2012-10-02 |
| 7973158 | Method of preparing benzoxazines | Andreas Taden, Alex Chor-Yiu Wong, Eric A. Parker | 2011-07-05 |
| 7851254 | B-stageable die attach adhesives | Deborah Forray, Benedicto delos Santos | 2010-12-14 |
| 7550825 | Interlayer dielectric and pre-applied die attach adhesive materials | Benedicto delos Santos, James T. Huneke, Kang Yang, Qing Ji | 2009-06-23 |
| 7517925 | Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof | Stephen M. Dershem, Farhad G. Mizori | 2009-04-14 |
| 7312534 | Interlayer dielectric and pre-applied die attach adhesive materials | Benedicto delos Santos, James T. Huneke, Kang Yang, Qing Ji | 2007-12-25 |
| 7199249 | Free radically polymerizable coupling agents | Stephen M. Dershem, Benjamin Neff, Maria Villegas | 2007-04-03 |
| 7176044 | B-stageable die attach adhesives | Deborah Forray, Benedicto delos Santos | 2007-02-13 |
| 7037447 | Conductive ink compositions | Kang Yang | 2006-05-02 |
| 6963001 | Low shrinkage thermosetting resin compositions and methods of use therefor | Stephen M. Dershem, Kang Yang | 2005-11-08 |
| 6960636 | Thermosetting resin compositions containing maleimide and/or vinyl compounds | Stephen M. Dershem | 2005-11-01 |
| 6946523 | Heterobifunctional monomers and uses therefor | Stephen M. Dershem, Kevin Forrestal | 2005-09-20 |
| 6831132 | Film adhesives containing maleimide compounds and methods for use thereof | Stephen M. Dershem, Kang Yang, Carolyn Albino | 2004-12-14 |
| 6743852 | Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof | Stephen M. Dershem, Farhad G. Mizori | 2004-06-01 |