Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7550825 | Interlayer dielectric and pre-applied die attach adhesive materials | James T. Huneke, Puwei Liu, Kang Yang, Qing Ji | 2009-06-23 |
| 7176044 | B-stageable die attach adhesives | Deborah Forray, Puwei Liu | 2007-02-13 |