Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7582510 | Electronic packaging materials for use with low-k dielectric-containing semiconductor devices | Michael George Todd, James T. Huneke, Gordon C. Fischer | 2009-09-01 |
| 7108920 | Reworkable compositions incorporating episulfide resins | Mark M. Konarski, Brendan Kneafsey, Afranio Torres-Filho, Z. Andrew Szczepaniak | 2006-09-19 |
| 7109061 | Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith | Mark M. Konarski, Erin K. Yaeger, Afranio Torres-Filho, J. Paul Krug, Rebecca Tishkoff | 2006-09-19 |
| 7009009 | Fluxing underfill compositions | Mark M. Konarski, J. Paul Krug, Andrew D. Messana, John G. Woods | 2006-03-07 |
| 6667194 | Method of bonding die chip with underfill fluxing composition | Mark M. Konarski, J. Paul Krug, Andrew D. Messana, John G. Woods | 2003-12-23 |
| 6657031 | Reworkable thermosetting resin compositions | Christopher K. Ober, Young Cheol Bae, Shuyan Yu, Jong-Wook Park | 2003-12-02 |
| 4894314 | Photoinitiator composition containing bis ketocoumarin dialkylamino benzoate, camphorquinone and/or a triphenylimidazolyl dimer | Robert K. Barr, Leo Roos | 1990-01-16 |
| 4588670 | Light-sensitive trisester of O-quinone diazide containing composition for the preparation of a positive-acting photoresist | Michael G. Kelly, Donald Mammato, Dana L. Durham, Sangya Jain | 1986-05-13 |