Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8847415 | Liquid compression molding encapsulants | Jie Bai, Kathryn Bearden | 2014-09-30 |
| 8053587 | Reworkable thermosetting resin composition | Philip T. Klemarczyk, Andrew D. Messana, Erin K. Yeager, Takahisa Doba | 2011-11-08 |
| 7109061 | Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith | Lawrence N. Crane, Mark M. Konarski, Erin K. Yaeger, J. Paul Krug, Rebecca Tishkoff | 2006-09-19 |
| 7108920 | Reworkable compositions incorporating episulfide resins | Lawrence N. Crane, Mark M. Konarski, Brendan Kneafsey, Z. Andrew Szczepaniak | 2006-09-19 |
| 7012120 | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent | Philp T. Klemarczyk, Andrew D. Messana, Erin K. Yaeger, Takahisa Doba | 2006-03-14 |
| 6887737 | Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom | John G. Woods, Rebecca Tishkoff, Erin K. Yaeger, Jianzhao Wang | 2005-05-03 |
| 5717217 | Method for determining thickness, degree of cure and other properties of a polymeric coating | Douglas C. Neckers, Jian Song | 1998-02-10 |
| 5606171 | Method for determining thickness, degree of cure and other properties of a polymeric coating or film | Douglas C. Neckers, Jian Song, Wolter F. Jager, Zhijun Wang | 1997-02-25 |