Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7109061 | Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith | Lawrence N. Crane, Mark M. Konarski, Erin K. Yaeger, Afranio Torres-Filho, Rebecca Tishkoff | 2006-09-19 |
| 7009009 | Fluxing underfill compositions | Lawrence N. Crane, Mark M. Konarski, Andrew D. Messana, John G. Woods | 2006-03-07 |
| 6667194 | Method of bonding die chip with underfill fluxing composition | Lawrence N. Crane, Mark M. Konarski, Andrew D. Messana, John G. Woods | 2003-12-23 |
| 6458472 | Fluxing underfill compositions | Mark M. Konarski | 2002-10-01 |