Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10995210 | Curable compositions | Donna M. Mamangun, Ling Li | 2021-05-04 |
| 10815388 | Primer compositions for injection molding | Nicholas W. Penrose, Darren Nolan, Brian Deegan | 2020-10-27 |
| 10141532 | Curable encapsulants and use thereof | Yuxia Liu, Charles W. Paul, Peter D. Palasz | 2018-11-27 |
| 9676928 | Curable encapsulants and use thereof | Yuxia Liu, Charles W. Paul, Peter D. Palasz | 2017-06-13 |
| 9080084 | Photolytically induced redox curable compositions | — | 2015-07-14 |
| 7915319 | Visible light curing systems, methods for reducing health risks to individuals exposed to systems designed to cure curable compositions by exposure to radiation, methods for bonding substrates and visible light curing compositions | Edwin Perez, Eerik Maandi, Vic Kadziela, Steven J. Hemsen, Ronald E. Belek | 2011-03-29 |
| 7547735 | UV curable compositions | Joel D. Schall | 2009-06-16 |
| 7193016 | Epoxy-extended polyacrylate toughening agent | John G. Woods, Kyra M. Kozak, Yuhshi Luh | 2007-03-20 |
| 7108920 | Reworkable compositions incorporating episulfide resins | Lawrence N. Crane, Brendan Kneafsey, Afranio Torres-Filho, Z. Andrew Szczepaniak | 2006-09-19 |
| 7109061 | Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith | Lawrence N. Crane, Erin K. Yaeger, Afranio Torres-Filho, J. Paul Krug, Rebecca Tishkoff | 2006-09-19 |
| 7087304 | Polysulfide-based toughening agents, compositions containing same and methods for the use thereof | John G. Woods, Yuhshi Luh | 2006-08-08 |
| 7009009 | Fluxing underfill compositions | Lawrence N. Crane, J. Paul Krug, Andrew D. Messana, John G. Woods | 2006-03-07 |
| 6951907 | Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex | — | 2005-10-04 |
| 6893736 | Thermosetting resin compositions useful as underfill sealants | — | 2005-05-17 |
| 6818318 | Underfill sealant of epoxy resins, adhesion promotor and curative of N-containing compound and transition metal complex | — | 2004-11-16 |
| 6706417 | Fluxing underfill compositions | Jeremy J. Bober | 2004-03-16 |
| 6670430 | Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes | — | 2003-12-30 |
| 6667194 | Method of bonding die chip with underfill fluxing composition | Lawrence N. Crane, J. Paul Krug, Andrew D. Messana, John G. Woods | 2003-12-23 |
| 6632893 | Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners | Zbigniew Andrew Szczepaniak | 2003-10-14 |
| 6617399 | Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners | — | 2003-09-09 |
| 6519968 | Shipping container for exothermic material | — | 2003-02-18 |
| 6458472 | Fluxing underfill compositions | J. Paul Krug | 2002-10-01 |
| 6391993 | High temperature, controlled strength anaerobic compositions curable under ambient environmental conditions | Shabbir Attarwala, Gina M. Mazzella, Hsien-Kun Chu, Dzu Luong, Lester D. Bennington +5 more | 2002-05-21 |
| 6342577 | Thermosetting resin compositions useful as underfill sealants | Zbigniew Andrew Szczepaniak | 2002-01-29 |