Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394756 | Backside integrated voltage regulator for integrated circuits | Namhoon Kim, Woon-Seong Kwon, Houle Gan, Yujeong Shim, Mikhail Popovich | 2025-08-19 |
| 12327817 | ASIC package with photonics and vertical power delivery | Woon-Seong Kwon, Nam Hoon Kim, Ryohei Urata | 2025-06-10 |
| 12315860 | Integrated circuit package for high bandwidth memory | Nam Hoon Kim, Woon-Seong Kwon, Yujeong Shim | 2025-05-27 |
| 12278217 | Backside integrated voltage regulator for integrated circuits | Namhoon Kim, Woon-Seong Kwon, Houle Gan, Yujeong Shim, Mikhail Popovich | 2025-04-15 |
| 12274079 | Deep trench capacitors embedded in package substrate | Nam Hoon Kim, Scott Kirkman, Woon-Seong Kwon | 2025-04-08 |
| 12243802 | Methods and heat distribution devices for thermal management of chip assemblies | Madhusudan K. Iyengar, Christopher G. Malone, Woon-Seong Kwon, Emad Samadiani, Melanie Beauchemin +6 more | 2025-03-04 |
| 12051679 | Backside interconnection interface die for integrated circuits package | Namhoon Kim, Woon-Seong Kwon | 2024-07-30 |
| 11990461 | Integrated circuit package for high bandwidth memory | Nam Hoon Kim, Woon-Seong Kwon, Yujeong Shim | 2024-05-21 |
| 11990386 | Methods and heat distribution devices for thermal management of chip assemblies | Madhusudan K. Iyengar, Christopher G. Malone, Woon-Seong Kwon, Emad Samadiani, Melanie Beauchemin +6 more | 2024-05-21 |
| 11978721 | ASIC package with photonics and vertical power delivery | Woon-Seong Kwon, Namhoon Kim, Ryohei Urata | 2024-05-07 |
| 11967538 | Three dimensional IC package with thermal enhancement | Woon-Seong Kwon, Xiaojin Wei, Madhusudan K. Iyengar | 2024-04-23 |
| 11955406 | Temperature control element utilized in device die packages | Yingying Wang, Emad Samadiani, Madhusudan K. Iyengar, Padam Jain, Xiaojin Wei +2 more | 2024-04-09 |
| 11830855 | Backside integrated voltage regulator for integrated circuits | Namhoon Kim, Woon-Seong Kwon, Houle Gan, Yujeong Shim, Mikhail Popovich | 2023-11-28 |
| 11832396 | Cooling electronic devices in a data center | Madhusudan K. Iyengar, Christopher G. Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon +1 more | 2023-11-28 |
| 11784215 | Deep trench capacitors embedded in package substrate | Nam Hoon Kim, Scott Kirkman, Woon-Seong Kwon | 2023-10-10 |
| 11488944 | Integrated circuit package for high bandwidth memory | Namhoon Kim, Woon-Seong Kwon, Yujeong Shim | 2022-11-01 |
| 11276668 | Backside integrated voltage regulator for integrated circuits | Nam Hoon Kim, Woon-Seong Kwon, Houle Gan, Yujeong Shim, Mikhail Popovich | 2022-03-15 |
| 11264295 | Integrated circuit substrate for containing liquid adhesive bleed-out | Woon-Seong Kwon, Ryohei Urata | 2022-03-01 |
| 11264358 | ASIC package with photonics and vertical power delivery | Woon-Seong Kwon, Namhoon Kim, Ryohei Urata | 2022-03-01 |
| 10964625 | Device and method for direct liquid cooling via metal channels | Padam Jain, Yuan Li, Madhusudan K. Iyengar | 2021-03-30 |
| 10930592 | Wafer level fan-out application specific integrated circuit bridge memory stack | Nam Hoon Kim, Woon-Seong Kwon | 2021-02-23 |
| 10896873 | Massive deep trench capacitor die fill for high performance application specific integrated circuit (ASIC) applications | Woon-Seong Kwon, Nam Hoon Kim | 2021-01-19 |
| 10818567 | Integrated circuit substrate for containing liquid adhesive bleed-out | Woon-Seong Kwon, Ryohei Urata | 2020-10-27 |
| 10681846 | Cooling electronic devices in a data center | Madhusudan K. Iyengar, Christopher G. Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon +1 more | 2020-06-09 |
| 10658322 | High bandwidth memory package for high performance processors | Woon-Seong Kwon, Nam Hoon Kim | 2020-05-19 |