| 12476227 |
Socket to support high performance multi-die ASICs |
Nam-Gun Kim, Jaekeun Lee, Teckgyu Kang |
2025-11-18 |
|
| 12470148 |
Trans-inductor voltage regulator for high bandwidth power delivery |
Shanglei Jiang, Xin Li, Cheng-Chieh Yang, Qifang Wang, Nam-Gun Kim +3 more |
2025-11-11 |
|
| 12394756 |
Backside integrated voltage regulator for integrated circuits |
Namhoon Kim, Houle Gan, Yujeong Shim, Mikhail Popovich, Teckgyu Kang |
2025-08-19 |
|
| 12327817 |
ASIC package with photonics and vertical power delivery |
Nam Hoon Kim, Teckgyu Kang, Ryohei Urata |
2025-06-10 |
|
| 12315860 |
Integrated circuit package for high bandwidth memory |
Nam Hoon Kim, Teckgyu Kang, Yujeong Shim |
2025-05-27 |
|
| 12308543 |
Structure for optimal XPU socket compression |
William Frank Edwards, Xu Zuo, Ryohei Urata, Melanie Beauchemin, Shinnosuke Yamamoto +2 more |
2025-05-20 |
|
| 12278160 |
Methods and heat distribution devices for thermal management of chip assemblies |
Yuan Li, Zhi Yang |
2025-04-15 |
|
| 12278217 |
Backside integrated voltage regulator for integrated circuits |
Namhoon Kim, Houle Gan, Yujeong Shim, Mikhail Popovich, Teckgyu Kang |
2025-04-15 |
|
| 12274079 |
Deep trench capacitors embedded in package substrate |
Nam Hoon Kim, Teckgyu Kang, Scott Kirkman |
2025-04-08 |
|
| 12243802 |
Methods and heat distribution devices for thermal management of chip assemblies |
Madhusudan K. Iyengar, Christopher G. Malone, Emad Samadiani, Melanie Beauchemin, Padam Jain +6 more |
2025-03-04 |
|
| 12051679 |
Backside interconnection interface die for integrated circuits package |
Namhoon Kim, Teckgyu Kang |
2024-07-30 |
$89,515,000 |
| 11990461 |
Integrated circuit package for high bandwidth memory |
Nam Hoon Kim, Teckgyu Kang, Yujeong Shim |
2024-05-21 |
$161,870,000 |
| 11990386 |
Methods and heat distribution devices for thermal management of chip assemblies |
Madhusudan K. Iyengar, Christopher G. Malone, Emad Samadiani, Melanie Beauchemin, Padam Jain +6 more |
2024-05-21 |
$161,870,000 |
| 11978721 |
ASIC package with photonics and vertical power delivery |
Namhoon Kim, Teckgyu Kang, Ryohei Urata |
2024-05-07 |
$112,500,000 |
| 11967538 |
Three dimensional IC package with thermal enhancement |
Xiaojin Wei, Madhusudan K. Iyengar, Teckgyu Kang |
2024-04-23 |
$109,442,000 |
| 11832396 |
Cooling electronic devices in a data center |
Madhusudan K. Iyengar, Christopher G. Malone, Yuan Li, Jorge Padilla, Teckgyu Kang +1 more |
2023-11-28 |
$71,046,000 |
| 11830855 |
Backside integrated voltage regulator for integrated circuits |
Namhoon Kim, Houle Gan, Yujeong Shim, Mikhail Popovich, Teckgyu Kang |
2023-11-28 |
$71,046,000 |
| 11784215 |
Deep trench capacitors embedded in package substrate |
Nam Hoon Kim, Teckgyu Kang, Scott Kirkman |
2023-10-10 |
$80,003,000 |
| 11600548 |
Methods and heat distribution devices for thermal management of chip assemblies |
Yuan Li, Zhi Yang |
2023-03-07 |
$88,184,000 |
| 11488944 |
Integrated circuit package for high bandwidth memory |
Namhoon Kim, Teckgyu Kang, Yujeong Shim |
2022-11-01 |
$86,307,000 |
| 11276668 |
Backside integrated voltage regulator for integrated circuits |
Nam Hoon Kim, Houle Gan, Yujeong Shim, Mikhail Popovich, Teckgyu Kang |
2022-03-15 |
$89,103,000 |
| 11264358 |
ASIC package with photonics and vertical power delivery |
Namhoon Kim, Teckgyu Kang, Ryohei Urata |
2022-03-01 |
$81,407,000 |
| 11264295 |
Integrated circuit substrate for containing liquid adhesive bleed-out |
Ryohei Urata, Teckgyu Kang |
2022-03-01 |
$81,407,000 |
| 10930592 |
Wafer level fan-out application specific integrated circuit bridge memory stack |
Nam Hoon Kim, Teckgyu Kang |
2021-02-23 |
$74,200,000 |
| 10896873 |
Massive deep trench capacitor die fill for high performance application specific integrated circuit (ASIC) applications |
Nam Hoon Kim, Teckgyu Kang |
2021-01-19 |
$86,250,000 |
