Issued Patents All Time
Showing 25 most recent of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394756 | Backside integrated voltage regulator for integrated circuits | Namhoon Kim, Houle Gan, Yujeong Shim, Mikhail Popovich, Teckgyu Kang | 2025-08-19 |
| 12327817 | ASIC package with photonics and vertical power delivery | Nam Hoon Kim, Teckgyu Kang, Ryohei Urata | 2025-06-10 |
| 12315860 | Integrated circuit package for high bandwidth memory | Nam Hoon Kim, Teckgyu Kang, Yujeong Shim | 2025-05-27 |
| 12308543 | Structure for optimal XPU socket compression | William Frank Edwards, Xu Zuo, Ryohei Urata, Melanie Beauchemin, Shinnosuke Yamamoto +2 more | 2025-05-20 |
| 12278217 | Backside integrated voltage regulator for integrated circuits | Namhoon Kim, Houle Gan, Yujeong Shim, Mikhail Popovich, Teckgyu Kang | 2025-04-15 |
| 12278160 | Methods and heat distribution devices for thermal management of chip assemblies | Yuan Li, Zhi Yang | 2025-04-15 |
| 12274079 | Deep trench capacitors embedded in package substrate | Nam Hoon Kim, Teckgyu Kang, Scott Kirkman | 2025-04-08 |
| 12243802 | Methods and heat distribution devices for thermal management of chip assemblies | Madhusudan K. Iyengar, Christopher G. Malone, Emad Samadiani, Melanie Beauchemin, Padam Jain +6 more | 2025-03-04 |
| 12051679 | Backside interconnection interface die for integrated circuits package | Namhoon Kim, Teckgyu Kang | 2024-07-30 |
| 11990386 | Methods and heat distribution devices for thermal management of chip assemblies | Madhusudan K. Iyengar, Christopher G. Malone, Emad Samadiani, Melanie Beauchemin, Padam Jain +6 more | 2024-05-21 |
| 11990461 | Integrated circuit package for high bandwidth memory | Nam Hoon Kim, Teckgyu Kang, Yujeong Shim | 2024-05-21 |
| 11978721 | ASIC package with photonics and vertical power delivery | Namhoon Kim, Teckgyu Kang, Ryohei Urata | 2024-05-07 |
| 11967538 | Three dimensional IC package with thermal enhancement | Xiaojin Wei, Madhusudan K. Iyengar, Teckgyu Kang | 2024-04-23 |
| 11830855 | Backside integrated voltage regulator for integrated circuits | Namhoon Kim, Houle Gan, Yujeong Shim, Mikhail Popovich, Teckgyu Kang | 2023-11-28 |
| 11832396 | Cooling electronic devices in a data center | Madhusudan K. Iyengar, Christopher G. Malone, Yuan Li, Jorge Padilla, Teckgyu Kang +1 more | 2023-11-28 |
| 11784215 | Deep trench capacitors embedded in package substrate | Nam Hoon Kim, Teckgyu Kang, Scott Kirkman | 2023-10-10 |
| 11600548 | Methods and heat distribution devices for thermal management of chip assemblies | Yuan Li, Zhi Yang | 2023-03-07 |
| 11488944 | Integrated circuit package for high bandwidth memory | Namhoon Kim, Teckgyu Kang, Yujeong Shim | 2022-11-01 |
| 11276668 | Backside integrated voltage regulator for integrated circuits | Nam Hoon Kim, Houle Gan, Yujeong Shim, Mikhail Popovich, Teckgyu Kang | 2022-03-15 |
| 11264358 | ASIC package with photonics and vertical power delivery | Namhoon Kim, Teckgyu Kang, Ryohei Urata | 2022-03-01 |
| 11264295 | Integrated circuit substrate for containing liquid adhesive bleed-out | Ryohei Urata, Teckgyu Kang | 2022-03-01 |
| 10930592 | Wafer level fan-out application specific integrated circuit bridge memory stack | Nam Hoon Kim, Teckgyu Kang | 2021-02-23 |
| 10896873 | Massive deep trench capacitor die fill for high performance application specific integrated circuit (ASIC) applications | Nam Hoon Kim, Teckgyu Kang | 2021-01-19 |
| 10818567 | Integrated circuit substrate for containing liquid adhesive bleed-out | Ryohei Urata, Teckgyu Kang | 2020-10-27 |
| 10681846 | Cooling electronic devices in a data center | Madhusudan K. Iyengar, Christopher G. Malone, Yuan Li, Jorge Padilla, Teckgyu Kang +1 more | 2020-06-09 |