Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308543 | Structure for optimal XPU socket compression | William Frank Edwards, Xu Zuo, Ryohei Urata, Woon-Seong Kwon, Shinnosuke Yamamoto +2 more | 2025-05-20 |
| 12243802 | Methods and heat distribution devices for thermal management of chip assemblies | Madhusudan K. Iyengar, Christopher G. Malone, Woon-Seong Kwon, Emad Samadiani, Padam Jain +6 more | 2025-03-04 |
| 11990386 | Methods and heat distribution devices for thermal management of chip assemblies | Madhusudan K. Iyengar, Christopher G. Malone, Woon-Seong Kwon, Emad Samadiani, Padam Jain +6 more | 2024-05-21 |
| 11895807 | Thermal management of battery units on data center racks | Madhusudan K. Iyengar, Christopher G. Malone | 2024-02-06 |
| 11650384 | Thermal optimizations for OSFP optical transceiver modules | William Frank Edwards, Timothy Conrad Lee, Federico P. Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau +2 more | 2023-05-16 |
| 11462852 | Blind mate thermal cooling solution for small form factor pluggable transceiver | Jerry Chiu | 2022-10-04 |
| 11348859 | Thermoelectric cooler (TEC) for spot cooling of 2.5D/3D IC packages | Madhusudan K. Iyengar, Christopher G. Malone, Gregory P. Imwalle | 2022-05-31 |
| 11249264 | Thermal optimizations for OSFP optical transceiver modules | William Frank Edwards, Timothy Conrad Lee, Federico P. Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau +2 more | 2022-02-15 |
| 10905038 | Electromagnetic interference (“EMI”) sheet attenuators | Federico P. Centola, Zuowei Shen, Xu Gao, Shawn E. Bender, Mark Villegas +2 more | 2021-01-26 |
| 10504816 | Thermoelectric cooler (TEC) for spot cooling of 2.5D/3D IC packages | Madhusudan K. Iyengar, Christopher G. Malone, Gregory P. Imwalle | 2019-12-10 |
| 9918377 | Heat dissipation approach in chip on board assembly by using stacked copper Microvias | Zuowei Shen, Kyle Fukuchi, Ryohei Urata | 2018-03-13 |
| 9641254 | Heat dissipation approach in chip on board assembly by using stacked copper microvias | Zuowei Shen, Kyle Fukuchi, Ryohei Urata | 2017-05-02 |
| 9614619 | Optical transceiver having separate transmitter and receiver lenses | Zuowei Shen, Jamyuen Ko, Hong Liu, Ryohei Urata | 2017-04-04 |
| 9379819 | Systems and methods for reducing temperature in an optical signal source co-packaged with a driver | Erji Mao, Hong Liu, Ryohei Urata | 2016-06-28 |
| 9313926 | Cooling heat-generating electronics | Michael Chi Kin Lau, Richard Chad Bruns | 2016-04-12 |
| 8644020 | Cooling heat-generating electronics | Michael Chi Kin Lau, Richard Chad Bruns | 2014-02-04 |