Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9918377 | Heat dissipation approach in chip on board assembly by using stacked copper Microvias | Zuowei Shen, Melanie Beauchemin, Ryohei Urata | 2018-03-13 |
| 9641254 | Heat dissipation approach in chip on board assembly by using stacked copper microvias | Zuowei Shen, Melanie Beauchemin, Ryohei Urata | 2017-05-02 |