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Thermal optimizations for OSFP optical transceiver modules |
Melanie Beauchemin, Timothy Conrad Lee, Federico P. Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau +2 more |
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Thermal optimizations for OSFP optical transceiver modules |
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Michael Chi Kin Lau, Justin Sishung Lee, Winnie Leung |
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Madhusudan K. Iyengar, Sundar Rajan, Jorge Padilla, Norman Paul Jouppi |
2020-05-05 |
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Ethernet magnetics package wire terminations |
Ki-Yuen Chau, Keith Frank Tharp, George Edward Curtis, Kayen Lin |
2019-10-15 |
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Package stiffener for protecting semiconductor die |
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2018-09-25 |
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Ethernet magnetics package wire terminations |
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2018-01-30 |
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Technologies for high-speed communications |
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2017-04-11 |
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ICM foot-print with UPOE support |
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ICM optimization and standardization for automation |
George Edward Curtis, Ki-Yuen Chau, Sandeep Arvindkumar Patel, Keith Frank Tharp |
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Technologies for high-speed communications |
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2015-12-08 |
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Spoon shaped electromagnetic interference fingers |
George Edward Curtis, Keith Frank Tharp |
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Receptacle connector |
Perry L. Hayden, Sr., Peter Lum, Flintstone Yu |
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Carrier card converter for 10 gigabit ethernet slots |
Alan Yee, Eric Wiles, James Paul Rivers, Sandeep Arvind Patel, Jeffrey D. Provost |
2009-11-17 |
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Van Van Nguyen, Gary McLeod |
2008-02-26 |
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Dual-stacked 10 Gigabit X2 uplinks in a single rack unit switch |
Samir Vasavda, Michael F. Kornprobst, David Nelsen |
2006-11-14 |
