Issued Patents All Time
Showing 1–25 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426208 | Modular liquid cooling architecture for liquid cooling | Jerry Chiu | 2025-09-23 |
| 12342508 | Continuous feed liquid coolant replacement | Jorge Padilla, Reza H. Khiabani | 2025-06-24 |
| 12315782 | Spring loaded compliant coolant distribution manifold for direct liquid cooled modules | Connor Burgess, Emad Samadiani, Padam Jain, Jorge Padilla, Feini Zhang +1 more | 2025-05-27 |
| 12315783 | Integrated circuit with a ring-shaped hot spot area and multidirectional cooling | Norman Paul Jouppi, Jorge Padilla, Christopher G. Malone | 2025-05-27 |
| 12272619 | Direct liquid cooling with O-ring sealing | Jorge Padilla, Connor Burgess, Padam Jain, Yuan Li, Feini Zhang | 2025-04-08 |
| 12243802 | Methods and heat distribution devices for thermal management of chip assemblies | Christopher G. Malone, Woon-Seong Kwon, Emad Samadiani, Melanie Beauchemin, Padam Jain +6 more | 2025-03-04 |
| 12174676 | Modular liquid cooling architecture for liquid cooling | Jerry Chiu, Reza H. Khiabani, Xiaojin Wei | 2024-12-24 |
| 11990386 | Methods and heat distribution devices for thermal management of chip assemblies | Christopher G. Malone, Woon-Seong Kwon, Emad Samadiani, Melanie Beauchemin, Padam Jain +6 more | 2024-05-21 |
| 11991857 | Modular liquid cooling architecture for liquid cooling | Jerry Chiu | 2024-05-21 |
| 11967538 | Three dimensional IC package with thermal enhancement | Woon-Seong Kwon, Xiaojin Wei, Teckgyu Kang | 2024-04-23 |
| 11955406 | Temperature control element utilized in device die packages | Yingying Wang, Emad Samadiani, Padam Jain, Xiaojin Wei, Teckgyu Kang +2 more | 2024-04-09 |
| 11895807 | Thermal management of battery units on data center racks | Melanie Beauchemin, Christopher G. Malone | 2024-02-06 |
| 11832396 | Cooling electronic devices in a data center | Christopher G. Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang +1 more | 2023-11-28 |
| 11737248 | Data center coolant switch | Pritish R. Parida, Mark D. Schultz | 2023-08-22 |
| 11721641 | Weight optimized stiffener and sealing structure for direct liquid cooled modules | Connor Burgess, Padam Jain, Emad Samadiani, Yuan Li | 2023-08-08 |
| 11683913 | Multiple supply and return connections for liquid cooling loop assemblies | Feini Zhang, Reza H. Khiabani | 2023-06-20 |
| 11650384 | Thermal optimizations for OSFP optical transceiver modules | William Frank Edwards, Melanie Beauchemin, Timothy Conrad Lee, Federico P. Centola, Michael Chi Kin Lau +2 more | 2023-05-16 |
| 11564334 | Installing a server board | Avinash Panga | 2023-01-24 |
| 11488890 | Direct liquid cooling with O-ring sealing | Jorge Padilla, Connor Burgess, Padam Jain, Yuan Li, Feini Zhang | 2022-11-01 |
| 11348859 | Thermoelectric cooler (TEC) for spot cooling of 2.5D/3D IC packages | Melanie Beauchemin, Christopher G. Malone, Gregory P. Imwalle | 2022-05-31 |
| 11249264 | Thermal optimizations for OSFP optical transceiver modules | William Frank Edwards, Melanie Beauchemin, Timothy Conrad Lee, Federico P. Centola, Michael Chi Kin Lau +2 more | 2022-02-15 |
| 11197397 | Provisioning data center server cooling equipment | Jerry Chiu, Skyler Salman | 2021-12-07 |
| 11158566 | Integrated circuit with a ring-shaped hot spot area and multidirectional cooling | Norman Paul Jouppi, Jorge Padilla, Christopher G. Malone | 2021-10-26 |
| 11019755 | Effectiveness-weighted control of cooling system components | Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Roger R. Schmidt +1 more | 2021-05-25 |
| 11013152 | Data center coolant switch | Pritish R. Parida, Mark D. Schultz | 2021-05-18 |