Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12174676 | Modular liquid cooling architecture for liquid cooling | Jerry Chiu, Reza H. Khiabani, Madhusudan K. Iyengar | 2024-12-24 |
| 11967538 | Three dimensional IC package with thermal enhancement | Woon-Seong Kwon, Madhusudan K. Iyengar, Teckgyu Kang | 2024-04-23 |
| 11955406 | Temperature control element utilized in device die packages | Yingying Wang, Emad Samadiani, Madhusudan K. Iyengar, Padam Jain, Teckgyu Kang +2 more | 2024-04-09 |
| 11081738 | Containment heatsink for packaged battery cells | Robert B. Schlak, Noah Singer, John G. Torok, Mitchell L. Zapotoski | 2021-08-03 |
| 10966351 | Heat pipe and vapor chamber heat dissipation | Allan C. VanDeventer | 2021-03-30 |
| 10903534 | Battery pack capacity optimization via self-regulation of cell temperature | Noah Singer, Steven J. Ahladas, Robert K. Mullady, Michael T. Peets | 2021-01-26 |
| 10797359 | Cooled containment compartments for packaged battery cells | Noah Singer, John G. Torok, Robert B. Schlak, Mitchell L. Zapotoski | 2020-10-06 |
| 10575440 | Heat pipe and vapor chamber heat dissipation | Allan C. VanDeventer | 2020-02-25 |
| 10374264 | Cooled containment compartments for packaged battery cells | Noah Singer, John G. Torok, Robert B. Schlak, Mitchell L. Zapotoski | 2019-08-06 |
| 10374263 | Cooled containment compartments for packaged battery cells | Noah Singer, John G. Torok, Robert B. Schlak, Mitchell L. Zapotoski | 2019-08-06 |
| 10237964 | Manufacturing electronic package with heat transfer element(s) | Phillip Duane Isaacs, Michael T. Peets | 2019-03-19 |
| 10045464 | Heat pipe and vapor chamber heat dissipation | Allan C. VanDeventer | 2018-08-07 |
| 9980410 | Heat pipe and vapor chamber heat dissipation | Allan C. VanDeventer | 2018-05-22 |
| 9913403 | Flexible coolant manifold—heat sink assembly | Francis R. Krug, Jr., Eric J. McKeever, Robert K. Mullady, Donald W. Porter, Richard P. Snider +2 more | 2018-03-06 |
| 9894807 | Changeable, airflow venting cover assembly for an electronics rack | Seth E. Bard, Frank E. Bosco, Gary F. Goth, William P. Kostenko, Steven C. McIntosh +3 more | 2018-02-13 |
| 9639105 | Thermal management in a multi-phase power system | Gary F. Goth, Robert Makowicki, Steven G. Shevach, Allan C. VanDeventer | 2017-05-02 |
| 9619166 | Control of solid state memory device temperature using queue depth management | Craig A. Bickelman, Edward W. Chencinski, Seth R. Greenspan, M. Dean Sciacca | 2017-04-11 |
| 9606562 | Thermal management in a multi-phase power system | Gary F. Goth, Robert Makowicki, Steven G. Shevach, Allan C. VanDeventer | 2017-03-28 |
| 9560737 | Electronic package with heat transfer element(s) | Phillip Duane Isaacs, Michael T. Peets | 2017-01-31 |
| 9501069 | Control of solid state memory device temperature using queue depth management | Craig A. Bickelman, Edward W. Chencinski, Seth R. Greenspan, M. Dean Sciacca | 2016-11-22 |
| 9504184 | Flexible coolant manifold-heat sink assembly | Francis R. Krug, Jr., Eric J. McKeever, Robert K. Mullady, Donald W. Porter, Richard P. Snider +2 more | 2016-11-22 |
| 9423804 | Control of solid state memory device temperature using queue depth management | Craig A. Bickelman, Edward W. Chencinski, Seth R. Greenspan, M. Dean Sciacca | 2016-08-23 |
| 8772927 | Semiconductor package structures having liquid cooler integrated with first level chip package modules | Raschid J. Bezama, Evan G. Colgan, Michael A. Gaynes, John Harold Magerlein, Kenneth C. Marston | 2014-07-08 |
| 8674506 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra +6 more | 2014-03-18 |
| 8455998 | Method and package for circuit chip packaging | Sushumna Iruvanti, Yves Martin, Theodore Kessel | 2013-06-04 |