| 12174676 |
Modular liquid cooling architecture for liquid cooling |
Jerry Chiu, Reza H. Khiabani, Madhusudan K. Iyengar |
2024-12-24 |
$142,724,000 |
| 11967538 |
Three dimensional IC package with thermal enhancement |
Woon-Seong Kwon, Madhusudan K. Iyengar, Teckgyu Kang |
2024-04-23 |
$109,442,000 |
| 11955406 |
Temperature control element utilized in device die packages |
Yingying Wang, Emad Samadiani, Madhusudan K. Iyengar, Padam Jain, Teckgyu Kang +2 more |
2024-04-09 |
$129,498,000 |
| 11081738 |
Containment heatsink for packaged battery cells |
Robert B. Schlak, Noah Singer, John G. Torok, Mitchell L. Zapotoski |
2021-08-03 |
$4,187,000 |
| 10966351 |
Heat pipe and vapor chamber heat dissipation |
Allan C. VanDeventer |
2021-03-30 |
|
| 10903534 |
Battery pack capacity optimization via self-regulation of cell temperature |
Noah Singer, Steven J. Ahladas, Robert K. Mullady, Michael T. Peets |
2021-01-26 |
$1,788,000 |
| 10797359 |
Cooled containment compartments for packaged battery cells |
Noah Singer, John G. Torok, Robert B. Schlak, Mitchell L. Zapotoski |
2020-10-06 |
$5,751,000 |
| 10575440 |
Heat pipe and vapor chamber heat dissipation |
Allan C. VanDeventer |
2020-02-25 |
$1,919,000 |
| 10374264 |
Cooled containment compartments for packaged battery cells |
Noah Singer, John G. Torok, Robert B. Schlak, Mitchell L. Zapotoski |
2019-08-06 |
$1,880,000 |
| 10374263 |
Cooled containment compartments for packaged battery cells |
Noah Singer, John G. Torok, Robert B. Schlak, Mitchell L. Zapotoski |
2019-08-06 |
$1,880,000 |
| 10237964 |
Manufacturing electronic package with heat transfer element(s) |
Phillip Duane Isaacs, Michael T. Peets |
2019-03-19 |
$3,213,000 |
| 10045464 |
Heat pipe and vapor chamber heat dissipation |
Allan C. VanDeventer |
2018-08-07 |
$1,950,000 |
| 9980410 |
Heat pipe and vapor chamber heat dissipation |
Allan C. VanDeventer |
2018-05-22 |
$7,737,000 |
| 9913403 |
Flexible coolant manifold—heat sink assembly |
Francis R. Krug, Jr., Eric J. McKeever, Robert K. Mullady, Donald W. Porter, Richard P. Snider +2 more |
2018-03-06 |
$2,330,000 |
| 9894807 |
Changeable, airflow venting cover assembly for an electronics rack |
Seth E. Bard, Frank E. Bosco, Gary F. Goth, William P. Kostenko, Steven C. McIntosh +3 more |
2018-02-13 |
$2,196,000 |
| 9639105 |
Thermal management in a multi-phase power system |
Gary F. Goth, Robert Makowicki, Steven G. Shevach, Allan C. VanDeventer |
2017-05-02 |
$3,833,000 |
| 9619166 |
Control of solid state memory device temperature using queue depth management |
Craig A. Bickelman, Edward W. Chencinski, Seth R. Greenspan, M. Dean Sciacca |
2017-04-11 |
$2,654,000 |
| 9606562 |
Thermal management in a multi-phase power system |
Gary F. Goth, Robert Makowicki, Steven G. Shevach, Allan C. VanDeventer |
2017-03-28 |
$2,520,000 |
| 9560737 |
Electronic package with heat transfer element(s) |
Phillip Duane Isaacs, Michael T. Peets |
2017-01-31 |
$3,813,000 |
| 9501069 |
Control of solid state memory device temperature using queue depth management |
Craig A. Bickelman, Edward W. Chencinski, Seth R. Greenspan, M. Dean Sciacca |
2016-11-22 |
$3,414,000 |
| 9504184 |
Flexible coolant manifold-heat sink assembly |
Francis R. Krug, Jr., Eric J. McKeever, Robert K. Mullady, Donald W. Porter, Richard P. Snider +2 more |
2016-11-22 |
$3,414,000 |
| 9423804 |
Control of solid state memory device temperature using queue depth management |
Craig A. Bickelman, Edward W. Chencinski, Seth R. Greenspan, M. Dean Sciacca |
2016-08-23 |
$3,302,000 |
| 8772927 |
Semiconductor package structures having liquid cooler integrated with first level chip package modules |
Raschid J. Bezama, Evan G. Colgan, Michael A. Gaynes, John Harold Magerlein, Kenneth C. Marston |
2014-07-08 |
$4,236,000 |
| 8674506 |
Structures and methods to reduce maximum current density in a solder ball |
Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra +6 more |
2014-03-18 |
$3,993,000 |
| 8455998 |
Method and package for circuit chip packaging |
Sushumna Iruvanti, Yves Martin, Theodore Kessel |
2013-06-04 |
$4,195,000 |
