Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784200 | Ionizing radiation blocking in IC chip to reduce soft errors | Mukta G. Farooq, Kevin S. Petrarca, Kenneth P. Rodbell | 2020-09-22 |
| 10438894 | Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor devices | Mukta G. Farooq, Koushik Ramachandran, Eric D. Perfecto | 2019-10-08 |
| 10276461 | Split probe pad structure and method | Mukta G. Farooq | 2019-04-30 |
| 10211175 | Stress-resilient chip structure and dicing process | Richard F. Indyk, Shigefumi Okada | 2019-02-19 |
| 10068899 | IC structure on two sides of substrate and method of forming | Mukta G. Farooq | 2018-09-04 |
| 10049979 | IC structure including TSV having metal resistant to high temperatures and method of forming same | Mukta G. Farooq | 2018-08-14 |
| 9947645 | Multi-project wafer with IP protection by reticle mask pattern modification | Soon Yoeng Tan, Teck Jung Tang, Yelei Vianna Yao, Yasushi Yamagata | 2018-04-17 |
| 9431359 | Coaxial solder bump support structure | Brian M. Erwin, Ekta Misra, George J. Scott | 2016-08-30 |
| 9069923 | IP protection | Soon Yoeng Tan, Teck Jung Tang, Yelei Vianna Yao, Yasushi Yamagata | 2015-06-30 |
| 9059167 | Structure and method for making crack stop for 3D integrated circuits | Mukta G. Farooq, John A. Griesemer, William Francis Landers, Thomas M. Shaw, Huilong Zhu | 2015-06-16 |
| 8999764 | Ionizing radiation blocking in IC chip to reduce soft errors | Mukta G. Farooq, Kevin S. Petrarca, Kenneth P. Rodbell | 2015-04-07 |
| 8922019 | Semiconductor device having a copper plug | Mukta G. Farooq, Emily R. Kinser, Krystyna W. Semkow | 2014-12-30 |
| 8859390 | Structure and method for making crack stop for 3D integrated circuits | Mukta G. Farooq, John A. Griesemer, William Francis Landers, Thomas M. Shaw, Huilong Zhu | 2014-10-14 |
| 8835289 | Wafer backside defectivity clean-up utilizing selective removal of substrate material | Jennifer C. Clark, Emily R. Kinser, Candace A. Sullivan | 2014-09-16 |
| 8786059 | Passivation layer surface topography modifications for improved integrity in packaged assemblies | Alexandre Blander, Jon A. Casey, Timothy H. Daubenspeck, Jennifer V. Muncy, Marie-Claude Paquet | 2014-07-22 |
| 8749059 | Semiconductor device having a copper plug | Mukta G. Farooq, Emily R. Kinser, Krystyna W. Semkow | 2014-06-10 |
| 8741769 | Semiconductor device having a copper plug | Mukta G. Farooq, Emily R. Kinser, Krystyna W. Semkow | 2014-06-03 |
| 8674506 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ekta Misra, George J. Scott +6 more | 2014-03-18 |
| 8610283 | Semiconductor device having a copper plug | Mukta G. Farooq, Emily R. Kinser, Krystyna W. Semkow | 2013-12-17 |
| 8563416 | Coaxial solder bump support structure | Brian M. Erwin, Ekta Misra, George J. Scott | 2013-10-22 |
| 8486814 | Wafer backside defectivity clean-up utilizing selective removal of substrate material | Jennifer C. Clark, Emily R. Kinser, Candace A. Sullivan | 2013-07-16 |
| 8446006 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ekta Misra, George J. Scott +6 more | 2013-05-21 |
| 8445374 | Soft error rate mitigation by interconnect structure | Mukta G. Farooq, Kevin S. Petrarca | 2013-05-21 |
| 8236615 | Passivation layer surface topography modifications for improved integrity in packaged assemblies | Alexandre Blander, Jon A. Casey, Timothy H. Daubenspeck, Jennifer V. Muncy, Marie-Claude Paquet | 2012-08-07 |
| 8120175 | Soft error rate mitigation by interconnect structure | Mukta G. Farooq, Kevin S. Petrarca | 2012-02-21 |