Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11168400 | Formation of terminal metallurgy on laminates and boards | Charles L. Arvin, Chris Muzzy, Thomas Weiss | 2021-11-09 |
| 11009545 | Integrated circuit tester probe contact liner | Charles L. Arvin, David M. Audette, Dennis R. Conti, Grant Wagner | 2021-05-18 |
| 10892249 | Carrier and integrated memory | Charles L. Arvin, Mark W. Kapfhammer, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss | 2021-01-12 |
| 10840214 | Carrier and integrated memory | Charles L. Arvin, Mark W. Kapfhammer, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss | 2020-11-17 |
| 10756041 | Finned contact | Charles L. Arvin, Clement Fortin, Chris Muzzy | 2020-08-25 |
| 10670653 | Integrated circuit tester probe contact liner | Charles L. Arvin, David M. Audette, Dennis R. Conti, Grant Wagner | 2020-06-02 |
| 10566275 | Element place on laminates | Charles L. Arvin, Brian W. Quinlan | 2020-02-18 |
| 10515929 | Carrier and integrated memory | Charles L. Arvin, Mark W. Kapfhammer, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss | 2019-12-24 |
| 10431563 | Carrier and integrated memory | Charles L. Arvin, Mark W. Kapfhammer, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss | 2019-10-01 |
| 10224269 | Element place on laminates | Charles L. Arvin, Brian W. Quinlan | 2019-03-05 |
| 10043723 | Method of forming a temporary test structure for device fabrication | Charles L. Arvin, Gary W. Maier | 2018-08-07 |
| 9997424 | Method of forming a temporary test structure for device fabrication | Charles L. Arvin, Gary W. Maier | 2018-06-12 |
| 9961765 | Security mesh and method of making | Charles L. Arvin | 2018-05-01 |
| 9899280 | Method of forming a temporary test structure for device fabrication | Charles L. Arvin, Gary W. Maier | 2018-02-20 |
| 9754823 | Substrate including selectively formed barrier layer | Yuri M. Brovman, Nicholas A. Polomoff, Jennifer D. Schuler, Matthew E. Souter, Christopher L. Tessler | 2017-09-05 |
| 9748135 | Substrate including selectively formed barrier layer | Yuri M. Brovman, Nicholas A. Polomoff, Jennifer D. Schuler, Matthew E. Souter, Christopher L. Tessler | 2017-08-29 |
| 9735071 | Method of forming a temporary test structure for device fabrication | Charles L. Arvin, Gary W. Maier | 2017-08-15 |
| 9728440 | Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer | Charles L. Arvin, Harry D. Cox, Jorge A. Lubguban, Eric D. Perfecto, Jennifer D. Schuler | 2017-08-08 |
| 9640492 | Laminate warpage control | Charles L. Arvin, Brian W. Quinlan | 2017-05-02 |
| 9601423 | Under die surface mounted electrical elements | Charles L. Arvin, Jon A. Casey, Steven P. Ostrander, Brian W. Quinlan | 2017-03-21 |
| 9565777 | Security mesh and method of making | Charles L. Arvin | 2017-02-07 |
| 9466547 | Passivation layer topography | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2016-10-11 |
| 9431359 | Coaxial solder bump support structure | Ian D. Melville, Ekta Misra, George J. Scott | 2016-08-30 |
| 9401336 | Dual layer stack for contact formation | Charles L. Arvin, Harry D. Cox, Sarah H. Knickerbocker, Karen P. McLaughlin, David J. Russell | 2016-07-26 |
| 9343420 | Universal solder joints for 3D packaging | Eric D. Perfecto, Nicholas A. Polomoff, Jae-Woong Nah | 2016-05-17 |