Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12141759 | Determining utility infrastructure and connectivity interruptions | Madhana Sunder, Noah Singer, James M. Crafts | 2024-11-12 |
| 11756930 | High bandwidth module | Charles L. Arvin, Bhupender Singh, Shidong Li, Thomas A. Wassick | 2023-09-12 |
| 11235404 | Personalized copper block for selective solder removal | Charles L. Arvin, Luca Del Carro, Thomas J. Brunschwiler, Thomas Weiss | 2022-02-01 |
| 11201136 | High bandwidth module | Charles L. Arvin, Bhupender Singh, Shidong Li, Thomas A. Wassick | 2021-12-14 |
| 11168400 | Formation of terminal metallurgy on laminates and boards | Charles L. Arvin, Brian M. Erwin, Thomas Weiss | 2021-11-09 |
| 11152282 | Localized catalyst for enhanced thermal interface material heat transfer | Charles L. Arvin, Kevin Drummond, Kenneth C. Marston, Sushumna Iruvanti | 2021-10-19 |
| 10993324 | Computer system with modified module socket | Charles L. Arvin, Mark K. Hoffmeyer, Kevin Drummond | 2021-04-27 |
| 10756041 | Finned contact | Charles L. Arvin, Brian M. Erwin, Clement Fortin | 2020-08-25 |