Issued Patents All Time
Showing 25 most recent of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11882645 | Multi chip hardware security module | Sushumna Iruvanti, James A. Busby, Philipp K Buchling Rego, Steven P. Ostrander, William Santiago-Fernandez +1 more | 2024-01-23 |
| 11756930 | High bandwidth module | Charles L. Arvin, Bhupender Singh, Shidong Li, Chris Muzzy | 2023-09-12 |
| 11201136 | High bandwidth module | Charles L. Arvin, Bhupender Singh, Shidong Li, Chris Muzzy | 2021-12-14 |
| 11121101 | Flip chip packaging rework | Charles L. Arvin, Karen P. McLaughlin, Brian W. Quinlan | 2021-09-14 |
| 11043468 | Lead-free solder joining of electronic structures | Charles L. Arvin, Clement Fortin, Christopher D. Muzzy | 2021-06-22 |
| 10985129 | Mitigating cracking within integrated circuit (IC) device carrier | Thomas E. Lombardi, Steve Ostrander, Krishna R. Tunga | 2021-04-20 |
| 10833025 | Compressive zone to reduce dicing defects | Kirk D. Peterson, Nicolas Pizzuti, Thomas M. Shaw | 2020-11-10 |
| 10833051 | Precision alignment of multi-chip high density interconnects | Charles L. Arvin, Thomas Weiss, Steve Ostrander | 2020-11-10 |
| 10755404 | Integrated circuit defect detection using pattern images | Chung-Ching Lin, Thomas M. Shaw, Peilin Song, Franco Stellari | 2020-08-25 |
| 10636750 | Step pyramid shaped structure to reduce dicing defects | Shidong Li, Kirk D. Peterson, Nicolas Pizzuti, Thomas M. Shaw | 2020-04-28 |
| 10586782 | Lead-free solder joining of electronic structures | Charles L. Arvin, Clement Fortin, Christopher D. Muzzy, Brian W. Quinlan, Thomas Weiss | 2020-03-10 |
| 10381276 | Test cell for laminate and method | Sushumna Iruvanti, Shidong Li, Marek A. Orlowski, David L. Questad, Tuhin Sinha +3 more | 2019-08-13 |
| 10249548 | Test cell for laminate and method | Sushumna Iruvanti, Shidong Li, Marek A. Orlowski, David L. Questad, Tuhin Sinha +3 more | 2019-04-02 |
| 9947598 | Determining crackstop strength of integrated circuit assembly at the wafer level | Krishna R. Tunga, Karen P. McLaughlin, Charles L. Arvin, Brian R. Sundlof, Steven P. Ostrander +1 more | 2018-04-17 |
| 9853006 | Semiconductor device contact structure having stacked nickel, copper, and tin layers | Charles L. Arvin, Harry D. Cox, Eric D. Perfecto | 2017-12-26 |
| 9793232 | All intermetallic compound with stand off feature and method to make | Charles L. Arvin, Luc Guerin, Sylvain E. Ouimet, Sylvain Pharand | 2017-10-17 |
| 9773726 | Three-dimensional integrated circuit integration | Timothy D. Sullivan | 2017-09-26 |
| 9515035 | Three-dimensional integrated circuit integration | Timothy D. Sullivan | 2016-12-06 |
| 9477568 | Managing interconnect electromigration effects | Malcolm S. Allen-Ware, Jon A. Casey, Sungjun Chun, Alan J. Drake, Charles R. Lefurgy +3 more | 2016-10-25 |
| 9396991 | Multilayered contact structure having nickel, copper, and nickel-iron layers | Charles L. Arvin, Harry D. Cox, Eric D. Perfecto | 2016-07-19 |
| 9379007 | Electromigration-resistant lead-free solder interconnect structures | Charles L. Arvin, KENNETH BIRD, Charles C. Goldsmith, Sung K. Kang, Minhua Lu +4 more | 2016-06-28 |
| 9190376 | Organic coating to inhibit solder wetting on pillar sidewalls | Charles L. Arvin, Brian M. Erwin, Eric D. Perfecto, Wolfgang Sauter | 2015-11-17 |
| 9142501 | Under ball metallurgy (UBM) for improved electromigration | Charles L. Arvin, Minhua Lu, Eric D. Perfecto, David J. Russell, Wolfgang Sauter +1 more | 2015-09-22 |
| 9084378 | Under ball metallurgy (UBM) for improved electromigration | Charles L. Arvin, Minhua Lu, Eric D. Perfecto, Krystyna W. Semkow | 2015-07-14 |
| 8674506 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra +6 more | 2014-03-18 |