| 11882645 |
Multi chip hardware security module |
Sushumna Iruvanti, James A. Busby, Philipp K Buchling Rego, Steven P. Ostrander, William Santiago-Fernandez +1 more |
2024-01-23 |
$16,624,000 |
| 11756930 |
High bandwidth module |
Charles L. Arvin, Bhupender Singh, Shidong Li, Chris Muzzy |
2023-09-12 |
$5,734,000 |
| 11201136 |
High bandwidth module |
Charles L. Arvin, Bhupender Singh, Shidong Li, Chris Muzzy |
2021-12-14 |
$4,192,000 |
| 11121101 |
Flip chip packaging rework |
Charles L. Arvin, Karen P. McLaughlin, Brian W. Quinlan |
2021-09-14 |
$2,674,000 |
| 11043468 |
Lead-free solder joining of electronic structures |
Charles L. Arvin, Clement Fortin, Christopher D. Muzzy |
2021-06-22 |
$6,016,000 |
| 10985129 |
Mitigating cracking within integrated circuit (IC) device carrier |
Thomas E. Lombardi, Steve Ostrander, Krishna R. Tunga |
2021-04-20 |
$5,008,000 |
| 10833025 |
Compressive zone to reduce dicing defects |
Kirk D. Peterson, Nicolas Pizzuti, Thomas M. Shaw |
2020-11-10 |
$848,000 |
| 10833051 |
Precision alignment of multi-chip high density interconnects |
Charles L. Arvin, Thomas Weiss, Steve Ostrander |
2020-11-10 |
$848,000 |
| 10755404 |
Integrated circuit defect detection using pattern images |
Chung-Ching Lin, Thomas M. Shaw, Peilin Song, Franco Stellari |
2020-08-25 |
$2,454,000 |
| 10636750 |
Step pyramid shaped structure to reduce dicing defects |
Shidong Li, Kirk D. Peterson, Nicolas Pizzuti, Thomas M. Shaw |
2020-04-28 |
$4,123,000 |
| 10586782 |
Lead-free solder joining of electronic structures |
Charles L. Arvin, Clement Fortin, Christopher D. Muzzy, Brian W. Quinlan, Thomas Weiss |
2020-03-10 |
$1,254,000 |
| 10381276 |
Test cell for laminate and method |
Sushumna Iruvanti, Shidong Li, Marek A. Orlowski, David L. Questad, Tuhin Sinha +3 more |
2019-08-13 |
$1,909,000 |
| 10249548 |
Test cell for laminate and method |
Sushumna Iruvanti, Shidong Li, Marek A. Orlowski, David L. Questad, Tuhin Sinha +3 more |
2019-04-02 |
$2,364,000 |
| 9947598 |
Determining crackstop strength of integrated circuit assembly at the wafer level |
Krishna R. Tunga, Karen P. McLaughlin, Charles L. Arvin, Brian R. Sundlof, Steven P. Ostrander +1 more |
2018-04-17 |
$1,989,000 |
| 9853006 |
Semiconductor device contact structure having stacked nickel, copper, and tin layers |
Charles L. Arvin, Harry D. Cox, Eric D. Perfecto |
2017-12-26 |
$7,266,000 |
| 9793232 |
All intermetallic compound with stand off feature and method to make |
Charles L. Arvin, Luc Guerin, Sylvain E. Ouimet, Sylvain Pharand |
2017-10-17 |
$4,096,000 |
| 9773726 |
Three-dimensional integrated circuit integration |
Timothy D. Sullivan |
2017-09-26 |
$3,108,000 |
| 9515035 |
Three-dimensional integrated circuit integration |
Timothy D. Sullivan |
2016-12-06 |
$2,582,000 |
| 9477568 |
Managing interconnect electromigration effects |
Malcolm S. Allen-Ware, Jon A. Casey, Sungjun Chun, Alan J. Drake, Charles R. Lefurgy +3 more |
2016-10-25 |
$7,053,000 |
| 9396991 |
Multilayered contact structure having nickel, copper, and nickel-iron layers |
Charles L. Arvin, Harry D. Cox, Eric D. Perfecto |
2016-07-19 |
$2,452,000 |
| 9379007 |
Electromigration-resistant lead-free solder interconnect structures |
Charles L. Arvin, KENNETH BIRD, Charles C. Goldsmith, Sung K. Kang, Minhua Lu +4 more |
2016-06-28 |
$2,208,000 |
| 9190376 |
Organic coating to inhibit solder wetting on pillar sidewalls |
Charles L. Arvin, Brian M. Erwin, Eric D. Perfecto, Wolfgang Sauter |
2015-11-17 |
$3,493,000 |
| 9142501 |
Under ball metallurgy (UBM) for improved electromigration |
Charles L. Arvin, Minhua Lu, Eric D. Perfecto, David J. Russell, Wolfgang Sauter +1 more |
2015-09-22 |
$4,871,000 |
| 9084378 |
Under ball metallurgy (UBM) for improved electromigration |
Charles L. Arvin, Minhua Lu, Eric D. Perfecto, Krystyna W. Semkow |
2015-07-14 |
$7,900,000 |
| 8674506 |
Structures and methods to reduce maximum current density in a solder ball |
Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra +6 more |
2014-03-18 |
$3,993,000 |
