| 11404365 |
Direct attachment of capacitors to flip chip dies |
Charles L. Arvin, Bhupender Singh, Mark W. Kapfhammer, Brian W. Quinlan |
2022-08-02 |
| 11310921 |
Buried via in a circuit board |
Kyle Indukummar Giesen, Matteo Cocchini |
2022-04-19 |
| 11209598 |
Photonics package with face-to-face bonding |
Barnim Alexander Janta-Polczynski, Isabel De Sousa, Jean Audet, Maryse Cournoyer, Roxan Lemire +2 more |
2021-12-28 |
| 11004614 |
Stacked capacitors for use in integrated circuit modules and the like |
Charles L. Arvin, Bhupender Singh, Brian W. Quinlan |
2021-05-11 |
| 9793232 |
All intermetallic compound with stand off feature and method to make |
Charles L. Arvin, Luc Guerin, Sylvain E. Ouimet, Thomas A. Wassick |
2017-10-17 |
| 9111793 |
Joining a chip to a substrate with solder alloys having different reflow temperatures |
— |
2015-08-18 |
| 8903531 |
Characterizing laminate shape |
Rejean P. Levesque, Isabelle Paquin, Denis Plouffe, Matthieu Lirette-Gelinas |
2014-12-02 |
| 8841209 |
Method for forming coreless flip chip ball grid array (FCBGA) substrates and such substrates formed by the method |
Sylvie Allard, Jean Audet, Kevin A. Dore, David J. Russell |
2014-09-23 |
| 7482180 |
Method for determining the impact of layer thicknesses on laminate warpage |
Julien Sylvestre, Jean Audet, Marco Gauvin |
2009-01-27 |
