Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404365 | Direct attachment of capacitors to flip chip dies | Charles L. Arvin, Bhupender Singh, Mark W. Kapfhammer, Brian W. Quinlan | 2022-08-02 |
| 11310921 | Buried via in a circuit board | Kyle Indukummar Giesen, Matteo Cocchini | 2022-04-19 |
| 11209598 | Photonics package with face-to-face bonding | Barnim Alexander Janta-Polczynski, Isabel De Sousa, Jean Audet, Maryse Cournoyer, Roxan Lemire +2 more | 2021-12-28 |
| 11004614 | Stacked capacitors for use in integrated circuit modules and the like | Charles L. Arvin, Bhupender Singh, Brian W. Quinlan | 2021-05-11 |
| 9793232 | All intermetallic compound with stand off feature and method to make | Charles L. Arvin, Luc Guerin, Sylvain E. Ouimet, Thomas A. Wassick | 2017-10-17 |
| 9111793 | Joining a chip to a substrate with solder alloys having different reflow temperatures | — | 2015-08-18 |
| 8903531 | Characterizing laminate shape | Rejean P. Levesque, Isabelle Paquin, Denis Plouffe, Matthieu Lirette-Gelinas | 2014-12-02 |
| 8841209 | Method for forming coreless flip chip ball grid array (FCBGA) substrates and such substrates formed by the method | Sylvie Allard, Jean Audet, Kevin A. Dore, David J. Russell | 2014-09-23 |
| 7482180 | Method for determining the impact of layer thicknesses on laminate warpage | Julien Sylvestre, Jean Audet, Marco Gauvin | 2009-01-27 |