| 11694992 |
Near tier decoupling capacitors |
Charles L. Arvin, Bhupender Singh, Joseph C. Sorbello, Joseph Jacobi, Thomas E. Lombardi +1 more |
2023-07-04 |
| 11521952 |
Spacer for die-to-die communication in an integrated circuit and method for fabricating the same |
Charles L. Arvin, Bhupender Singh, Richard F. Indyk, Steve Ostrander, Thomas Weiss |
2022-12-06 |
| 11404365 |
Direct attachment of capacitors to flip chip dies |
Charles L. Arvin, Bhupender Singh, Brian W. Quinlan, Sylvain Pharand |
2022-08-02 |
| 11393759 |
Alignment carrier for interconnect bridge assembly |
Thomas Weiss, Charles L. Arvin, Glenn A. Pomerantz, Rachel E. Olson, Bhupender Singh |
2022-07-19 |
| 11177217 |
Direct bonded heterogeneous integration packaging structures |
Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more |
2021-11-16 |
| 11031373 |
Spacer for die-to-die communication in an integrated circuit |
Charles L. Arvin, Bhupender Singh, Richard F. Indyk, Steve Ostrander, Thomas Weiss |
2021-06-08 |
| 10916507 |
Multiple chip carrier for bridge assembly |
Charles L. Arvin, Brian W. Quinlan, Steve Ostrander, Thomas Weiss, Shidong Li |
2021-02-09 |
| 10892249 |
Carrier and integrated memory |
Charles L. Arvin, Brian M. Erwin, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss |
2021-01-12 |
| 10840214 |
Carrier and integrated memory |
Charles L. Arvin, Brian M. Erwin, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss |
2020-11-17 |
| 10580738 |
Direct bonded heterogeneous integration packaging structures |
Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more |
2020-03-03 |
| 10515929 |
Carrier and integrated memory |
Charles L. Arvin, Brian M. Erwin, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss |
2019-12-24 |
| 10431563 |
Carrier and integrated memory |
Charles L. Arvin, Brian M. Erwin, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss |
2019-10-01 |
| 9673177 |
Selectively soluble standoffs for chip joining |
Benjamin V. Fasano, David J. Lewison, Thomas E. Lombardi, Thomas Weiss |
2017-06-06 |
| 8232636 |
Reliability enhancement of metal thermal interface |
James N. Humenik, Sushumna Iruvanti, Richard Langlois, Hsichang Liu, Govindarajan Natarajan +4 more |
2012-07-31 |
| 7806312 |
Method and apparatus for removing known good die |
Lannie R. Bolde, James H. Covell |
2010-10-05 |
| 7645423 |
Optical micro plugs for multichannel and multilayer pharmaceutical device |
Govindarajan Natarajan, David H. Gabriels, Richard A. Shelleman, Kurt A. Smith |
2010-01-12 |
| 7168609 |
Method and apparatus for removing known good die |
Lannie R. Bolde, James H. Covell |
2007-01-30 |
| 6272957 |
Flex die punching apparatus and method |
William Dale Carbaugh, Jr., Lester W. Herron, Mark J. LaPlante, David C. Long, Nabil Amir Rizk +1 more |
2001-08-14 |
| 6207330 |
Formation of punch inspection masks and other devices using a laser |
James G. Balz, Mark J. LaPlante, David C. Long |
2001-03-27 |
| 6127069 |
Method of visually inspecting positioning of a pattern on a substrate |
James G. Balz, Mark J. LaPlante, David C. Long |
2000-10-03 |
| 6116127 |
Flex die punching apparatus and method |
William Dale Carbaugh, Jr., Lester W. Herron, Mark J. LaPlante, David C. Long, Nabil Amir Rizk +1 more |
2000-09-12 |
| 5974931 |
Flex die punching apparatus and method |
William Dale Carbaugh, Jr., Lester W. Herron, Mark J. LaPlante, David C. Long, Nabil Amir Rizk +1 more |
1999-11-02 |
| 5958628 |
Formation of punch inspection masks and other devices using a laser |
James G. Balz, Mark J. LaPlante, David C. Long |
1999-09-28 |
| 5929865 |
Method of sorting two-dimensional graphic images for converting into raster lines |
James G. Balz, Mark J. LaPlante, David C. Long |
1999-07-27 |
| 5522963 |
Method for machining and depositing metallurgy on ceramic layers |
Robert H. Anders, Jr., William Cobbett, Jr., William T. Grant, Nabil Amir Rizk, Nirmal S. Sandhu +2 more |
1996-06-04 |
