Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694992 | Near tier decoupling capacitors | Charles L. Arvin, Bhupender Singh, Joseph C. Sorbello, Joseph Jacobi, Thomas E. Lombardi +1 more | 2023-07-04 |
| 11521952 | Spacer for die-to-die communication in an integrated circuit and method for fabricating the same | Charles L. Arvin, Bhupender Singh, Richard F. Indyk, Steve Ostrander, Thomas Weiss | 2022-12-06 |
| 11404365 | Direct attachment of capacitors to flip chip dies | Charles L. Arvin, Bhupender Singh, Brian W. Quinlan, Sylvain Pharand | 2022-08-02 |
| 11393759 | Alignment carrier for interconnect bridge assembly | Thomas Weiss, Charles L. Arvin, Glenn A. Pomerantz, Rachel E. Olson, Bhupender Singh | 2022-07-19 |
| 11177217 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2021-11-16 |
| 11031373 | Spacer for die-to-die communication in an integrated circuit | Charles L. Arvin, Bhupender Singh, Richard F. Indyk, Steve Ostrander, Thomas Weiss | 2021-06-08 |
| 10916507 | Multiple chip carrier for bridge assembly | Charles L. Arvin, Brian W. Quinlan, Steve Ostrander, Thomas Weiss, Shidong Li | 2021-02-09 |
| 10892249 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss | 2021-01-12 |
| 10840214 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss | 2020-11-17 |
| 10580738 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2020-03-03 |
| 10515929 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss | 2019-12-24 |
| 10431563 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss | 2019-10-01 |
| 9673177 | Selectively soluble standoffs for chip joining | Benjamin V. Fasano, David J. Lewison, Thomas E. Lombardi, Thomas Weiss | 2017-06-06 |
| 8232636 | Reliability enhancement of metal thermal interface | James N. Humenik, Sushumna Iruvanti, Richard Langlois, Hsichang Liu, Govindarajan Natarajan +4 more | 2012-07-31 |
| 7806312 | Method and apparatus for removing known good die | Lannie R. Bolde, James H. Covell | 2010-10-05 |
| 7645423 | Optical micro plugs for multichannel and multilayer pharmaceutical device | Govindarajan Natarajan, David H. Gabriels, Richard A. Shelleman, Kurt A. Smith | 2010-01-12 |
| 7168609 | Method and apparatus for removing known good die | Lannie R. Bolde, James H. Covell | 2007-01-30 |
| 6272957 | Flex die punching apparatus and method | William Dale Carbaugh, Jr., Lester W. Herron, Mark J. LaPlante, David C. Long, Nabil Amir Rizk +1 more | 2001-08-14 |
| 6207330 | Formation of punch inspection masks and other devices using a laser | James G. Balz, Mark J. LaPlante, David C. Long | 2001-03-27 |
| 6127069 | Method of visually inspecting positioning of a pattern on a substrate | James G. Balz, Mark J. LaPlante, David C. Long | 2000-10-03 |
| 6116127 | Flex die punching apparatus and method | William Dale Carbaugh, Jr., Lester W. Herron, Mark J. LaPlante, David C. Long, Nabil Amir Rizk +1 more | 2000-09-12 |
| 5974931 | Flex die punching apparatus and method | William Dale Carbaugh, Jr., Lester W. Herron, Mark J. LaPlante, David C. Long, Nabil Amir Rizk +1 more | 1999-11-02 |
| 5958628 | Formation of punch inspection masks and other devices using a laser | James G. Balz, Mark J. LaPlante, David C. Long | 1999-09-28 |
| 5929865 | Method of sorting two-dimensional graphic images for converting into raster lines | James G. Balz, Mark J. LaPlante, David C. Long | 1999-07-27 |
| 5522963 | Method for machining and depositing metallurgy on ceramic layers | Robert H. Anders, Jr., William Cobbett, Jr., William T. Grant, Nabil Amir Rizk, Nirmal S. Sandhu +2 more | 1996-06-04 |