Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404365 | Direct attachment of capacitors to flip chip dies | Charles L. Arvin, Bhupender Singh, Mark W. Kapfhammer, Sylvain Pharand | 2022-08-02 |
| 11388821 | Thin film capacitors for core and adjacent build up layers | Charles L. Arvin, Charles L. Reynolds, Jean Audet, Francesco Preda | 2022-07-12 |
| 11282773 | Enlarged conductive pad structures for enhanced chip bond assembly yield | Krishna R. Tunga, Thomas Weiss, Charles L. Arvin, Bhupender Singh | 2022-03-22 |
| 11239183 | Mitigating thermal-mechanical strain and warpage of an organic laminate substrate | Tuhin Sinha, Krishna R. Tunga, Charles L. Arvin, Steven P. Ostrander, Thomas Weiss | 2022-02-01 |
| 11121101 | Flip chip packaging rework | Charles L. Arvin, Karen P. McLaughlin, Thomas A. Wassick | 2021-09-14 |
| 11004614 | Stacked capacitors for use in integrated circuit modules and the like | Charles L. Arvin, Sylvain Pharand, Bhupender Singh | 2021-05-11 |
| 10957650 | Bridge support structure | Charles L. Arvin, Karen P. McLaughlin, Thomas Weiss | 2021-03-23 |
| 10916507 | Multiple chip carrier for bridge assembly | Charles L. Arvin, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer, Shidong Li | 2021-02-09 |
| 10892249 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Mark W. Kapfhammer, Charles L. Reynolds, Thomas Weiss | 2021-01-12 |
| 10840214 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Mark W. Kapfhammer, Charles L. Reynolds, Thomas Weiss | 2020-11-17 |
| 10770385 | Connected plane stiffener within integrated circuit chip carrier | Anson J. Call, Krishna R. Tunga | 2020-09-08 |
| 10756031 | Decoupling capacitor stiffener | Charles L. Arvin, Franklin M. Baez, Charles L. Reynolds, Krishna R. Tunga, Thomas Weiss | 2020-08-25 |
| 10660209 | Thin film capacitors for core and adjacent build up layers | Charles L. Arvin, Charles L. Reynolds, Jean Audet, Francesco Preda | 2020-05-19 |
| 10622299 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Jean Audet, Charles L. Reynolds, Brian R. Sundlof | 2020-04-14 |
| 10607928 | Reduction of laminate failure in integrated circuit (IC) device carrier | Anson J. Call, Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Rui Wang | 2020-03-31 |
| 10586782 | Lead-free solder joining of electronic structures | Charles L. Arvin, Clement Fortin, Christopher D. Muzzy, Thomas A. Wassick, Thomas Weiss | 2020-03-10 |
| 10566275 | Element place on laminates | Charles L. Arvin, Brian M. Erwin | 2020-02-18 |
| 10515929 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Mark W. Kapfhammer, Charles L. Reynolds, Thomas Weiss | 2019-12-24 |
| 10431563 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Mark W. Kapfhammer, Charles L. Reynolds, Thomas Weiss | 2019-10-01 |
| 10224274 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Jean Audet, Charles L. Reynolds, Brian R. Sundlof | 2019-03-05 |
| 10224273 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Jean Audet, Charles L. Reynolds, Brian R. Sundlof | 2019-03-05 |
| 10224269 | Element place on laminates | Charles L. Arvin, Brian M. Erwin | 2019-03-05 |
| 9899313 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Jean Audet, Charles L. Reynolds, Brian R. Sundlof | 2018-02-20 |
| 9743526 | Wiring board with stacked embedded capacitors and method of making | Edmund Blackshear, Keiichi Hirabayashi, Yoichi Miyazawa, Junji Sato | 2017-08-22 |
| 9640492 | Laminate warpage control | Charles L. Arvin, Brian M. Erwin | 2017-05-02 |