Issued Patents All Time
Showing 25 most recent of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431404 | Fatigue failure resistant electronic package | Kamal K. Sikka, Tuhin Sinha, Jeffrey A. Zitz | 2025-09-30 |
| 12360275 | Method for monitoring hydraulic fracturing range of surface vertical shaft | Sitao Zhu, Xiaoguang Shang, Xiufeng Zhang, Longkai Hao, Chao Wang +8 more | 2025-07-15 |
| 12052825 | Flexible circuit structure for circuit line bending | Hongqing Zhang, Guoda Lian, Junjun Li, Zhigang Song | 2024-07-30 |
| 12024935 | Refrigerator | Bin Hui, Ning Wang, Zhijun Liu, Xiaobin Hu | 2024-07-02 |
| 11994338 | Control method for drawer door of refrigerator and refrigerator | Bin Hui, Zhijun Liu, Xiaobin Hu, Guoshuai Cao | 2024-05-28 |
| 11887908 | Electronic package structure with offset stacked chips and top and bottom side cooling lid | Kamal K. Sikka, Katsuyuki Sakuma, Hilton T. Toy, Ravi K. Bonam | 2024-01-30 |
| 11784160 | Asymmetric die bonding | Katsuyuki Sakuma, Krishna R. Tunga, Griselda Bonilla | 2023-10-10 |
| 11756930 | High bandwidth module | Charles L. Arvin, Bhupender Singh, Chris Muzzy, Thomas A. Wassick | 2023-09-12 |
| 11694992 | Near tier decoupling capacitors | Charles L. Arvin, Bhupender Singh, Joseph C. Sorbello, Joseph Jacobi, Thomas E. Lombardi +1 more | 2023-07-04 |
| 11569181 | Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers | Sushumna Iruvanti, Steve Ostrander, Jon A. Casey, Brian R. Sundlof | 2023-01-31 |
| 11527462 | Circuit substrate with mixed pitch wiring | Katsuyuki Sakuma, Kamal K. Sikka | 2022-12-13 |
| 11453826 | Liquid crystal alignment agent, liquid crystal alignment film and liquid crystal display element | Wanlong Xie, Xiaorui Wang, Mingjiao Wang, Huicai Ren, Hu SUN | 2022-09-27 |
| 11448450 | Refrigerator and control method thereof | Mingyong Liu, Ning Wang, Yuan Wang, Heng Zhang | 2022-09-20 |
| 11430710 | Lid/heat spreader having targeted flexibility | Jay A. Bunt, Kenneth C. Marston, Hilton T. Toy, Hongqing Zhang, David J. Lewison | 2022-08-30 |
| 11410905 | Optimized weight heat spreader for an electronic package | Kamal K. Sikka, Kenneth C. Marston, Tuhin Sinha | 2022-08-09 |
| 11410894 | Polygon integrated circuit (IC) packaging | Charles L. Arvin, Richard F. Indyk, Bhupender Singh, Jon A. Casey | 2022-08-09 |
| 11304378 | Aquatic weed planting plate for aquarium | Xin Jin, Peng Wang, Ying Song | 2022-04-19 |
| 11302651 | Laminated stiffener to control the warpage of electronic chip carriers | Kamal K. Sikka, Krishna R. Tunga, Hilton T. Toy, Thomas Weiss, Sushumna Iruvanti | 2022-04-12 |
| 11264306 | Hybrid TIMs for electronic package cooling | Kamal K. Sikka, Piyas Bal Chowdhury, James J. Kelly, Jeffrey A. Zitz, Sushumna Iruvanti | 2022-03-01 |
| 11201136 | High bandwidth module | Charles L. Arvin, Bhupender Singh, Chris Muzzy, Thomas A. Wassick | 2021-12-14 |
| 11191155 | Tamper-respondent assembly with structural material within sealed inner compartment | Hongqing Zhang, Jay A. Bunt, Zhigang Song, Junjun Li, Guoda Lian | 2021-11-30 |
| 11121096 | Active control of electronic package warpage | Katsuyuki Sakuma | 2021-09-14 |
| 11098946 | Door-in-door having display screen assembly and refrigerator having the same | Mingyong Liu, Ning Wang, Weijian Fu, Yuan Wang, Heng Zhang | 2021-08-24 |
| 10916507 | Multiple chip carrier for bridge assembly | Charles L. Arvin, Brian W. Quinlan, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer | 2021-02-09 |
| 10892233 | Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers | Sushumna Iruvanti, Steve Ostrander, Jon A. Casey, Brian R. Sundlof | 2021-01-12 |