| D1101184 |
Lab scanner |
Asbjørn Stjernegaard Harder, Oleksandr Burymskyi, Eskild Hansen, Sindri Sighvatsson |
2025-11-04 |
|
| 11825592 |
Electronic device console with natural draft cooling |
Kamal K. Sikka, Chenzhou Lian, Kathryn C. Rivera, Paul F. Bodenweber |
2023-11-21 |
$7,457,000 |
| 11569181 |
Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers |
Sushumna Iruvanti, Shidong Li, Steve Ostrander, Brian R. Sundlof |
2023-01-31 |
$7,725,000 |
| 11410894 |
Polygon integrated circuit (IC) packaging |
Charles L. Arvin, Richard F. Indyk, Bhupender Singh, Shidong Li |
2022-08-09 |
$6,406,000 |
| 11177217 |
Direct bonded heterogeneous integration packaging structures |
Kamal K. Sikka, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta, Charles L. Arvin +5 more |
2021-11-16 |
$1,912,000 |
| 11031343 |
Fins for enhanced die communication |
Charles L. Arvin, Richard F. Indyk, Bhupender Singh |
2021-06-08 |
$4,452,000 |
| 10892233 |
Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers |
Sushumna Iruvanti, Shidong Li, Steve Ostrander, Brian R. Sundlof |
2021-01-12 |
$3,912,000 |
| 10834808 |
Electronic device console with natural draft cooling |
Paul F. Bodenweber, Chenzhou Lian, Kathryn C. Rivera, Kamal K. Sikka |
2020-11-10 |
$848,000 |
| 10580738 |
Direct bonded heterogeneous integration packaging structures |
Kamal K. Sikka, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta, Charles L. Arvin +5 more |
2020-03-03 |
$1,865,000 |
| 9601423 |
Under die surface mounted electrical elements |
Charles L. Arvin, Brian M. Erwin, Steven P. Ostrander, Brian W. Quinlan |
2017-03-21 |
$2,195,000 |
| 9477568 |
Managing interconnect electromigration effects |
Malcolm S. Allen-Ware, Sungjun Chun, Alan J. Drake, Charles R. Lefurgy, Karthick Rajamani +3 more |
2016-10-25 |
$7,053,000 |
| 9226426 |
Electronic device console with natural draft cooling |
Paul F. Bodenweber, Chenzhou Lian, Kathryn C. Rivera, Kamal K. Sikka |
2015-12-29 |
$4,224,000 |
| 8786059 |
Passivation layer surface topography modifications for improved integrity in packaged assemblies |
Alexandre Blander, Timothy H. Daubenspeck, Ian D. Melville, Jennifer V. Muncy, Marie-Claude Paquet |
2014-07-22 |
$5,473,000 |
| 8680670 |
Multi-chip module system with removable socketed modules |
John L. Colbert, Paul M. Harvey, Mark K. Hoffmeyer, Charles L. Reynolds |
2014-03-25 |
$4,381,000 |
| 8421217 |
Achieving mechanical and thermal stability in a multi-chip package |
John Saunders Corbin, Jr., David Danovitch, Isabelle Depatie, Virendra R. Jadhav, Roger A. Liptak +4 more |
2013-04-16 |
$3,567,000 |
| 8236615 |
Passivation layer surface topography modifications for improved integrity in packaged assemblies |
Alexandre Blander, Timothy H. Daubenspeck, Ian D. Melville, Jennifer V. Muncy, Marie-Claude Paquet |
2012-08-07 |
$7,112,000 |
| 8214658 |
Enhanced thermal management for improved module reliability |
Michael Stephen Floyd, Soraya Ghiasi, Kenneth C. Marston, Jennifer V. Muncy, Malcolm S. Ware +1 more |
2012-07-03 |
$4,930,000 |
| 8202765 |
Achieving mechanical and thermal stability in a multi-chip package |
John Saunders Corbin, Jr., David Danovitch, Isabelle Depatie, Virendra R. Jadhav, Roger A. Liptak +4 more |
2012-06-19 |
$12,855,000 |
| 8119206 |
Negative coefficient of thermal expansion particles |
Gareth G. Hougham, Xiao Hu Liu, S. Jay Chey, Joseph Zinter, Michael J. Rooks +1 more |
2012-02-21 |
$5,017,000 |
| 7917328 |
Tracking thermal mini-cycle stress |
Michael Stephen Floyd, Soraya Ghiasi, Kenneth C. Marston, Jennifer V. Muncy, Malcom S. Ware +1 more |
2011-03-29 |
$5,031,000 |
| 7875502 |
Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners |
Peter J. Brofman, Ian D. Melville, David L. Questad, Wolfgang Sauter, Thomas A. Wassick |
2011-01-25 |
$4,442,000 |
| 7815968 |
Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation |
Gareth G. Hougham, Leena Paivikki Buchwalter, Stephen L. Buchwalter, Claudius Feger, Matteo Flotta +5 more |
2010-10-19 |
$3,706,000 |
| 7732932 |
Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners |
Peter J. Brofman, Ian D. Melville, David L. Questad, Wolfgang Sauter, Thomas A. Wassick |
2010-06-08 |
$3,517,000 |
| 7579069 |
Negative coefficient of thermal expansion particles and method of forming the same |
Gareth G. Hougham, Xiao Hu Liu, S. Jay Chey, James P. Doyle, Joseph Zinter +2 more |
2009-08-25 |
$21,245,000 |
| 7452568 |
Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation |
Gareth G. Hougham, Leena Paivikki Buchwalter, Stephen L. Buchwalter, Claudius Feger, Matteo Flotta +5 more |
2008-11-18 |
$4,805,000 |
