Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9042120 | Grounded lid for micro-electronic assemblies | Martin Beaumier, Pascale Gagnon, Michael A. Gaynes, Eric Giguere, Eric Salvas +1 more | 2015-05-26 |
| 8910853 | Additives for grain fragmentation in Pb-free Sn-based solder | Charles L. Arvin, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham, Hsichang Liu +7 more | 2014-12-16 |
| 8786059 | Passivation layer surface topography modifications for improved integrity in packaged assemblies | Jon A. Casey, Timothy H. Daubenspeck, Ian D. Melville, Jennifer V. Muncy, Marie-Claude Paquet | 2014-07-22 |
| 8614900 | Grounded lid for micro-electronic assemblies | Martin Beaumier, Pascale Gagnon, Michael A. Gaynes, Eric Giguere, Eric Salvas +1 more | 2013-12-24 |
| 8493746 | Additives for grain fragmentation in Pb-free Sn-based solder | Charles L. Arvin, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham, Hsichang Liu +7 more | 2013-07-23 |
| 8236615 | Passivation layer surface topography modifications for improved integrity in packaged assemblies | Jon A. Casey, Timothy H. Daubenspeck, Ian D. Melville, Jennifer V. Muncy, Marie-Claude Paquet | 2012-08-07 |
| 7512518 | Method for measuring thin layers in solid state devices | Richard Brassard, Carl Savard, Julien Sylvestre | 2009-03-31 |