| 10141236 |
Flip chip ball grid array with low impedence and grounded lid |
Yves Dallaire, Melania C. Doll, Michael A. Gaynes, Edward J. Yarmchuk |
2018-11-27 |
| 10043725 |
Flip chip ball grid array with low impedence and grounded lid |
Yves Dallaire, Melania C. Doll, Michael A. Gaynes, Edward J. Yarmchuk |
2018-08-07 |
| 9786572 |
Flip chip ball grid array with low impedance and grounded lid |
Yves Dallaire, Melania C. Doll, Michael Michael Gaynes, Edward J. Yarmchuk |
2017-10-10 |
| 9219051 |
Laminate peripheral clamping to control microelectronic module BSM warpage |
Stephanie Allard, Jean-Francois Drapeau, Jean Labonte, Steven P. Ostrander, Sylvain Ouimet |
2015-12-22 |
| 9042120 |
Grounded lid for micro-electronic assemblies |
Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Giguere, Eric Salvas +1 more |
2015-05-26 |
| 8906809 |
Multichip electronic packages and methods of manufacture |
Steven P. Ostrander, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz |
2014-12-09 |
| 8900927 |
Multichip electronic packages and methods of manufacture |
Steven P. Ostrander, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz |
2014-12-02 |
| 8614900 |
Grounded lid for micro-electronic assemblies |
Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Giguere, Eric Salvas +1 more |
2013-12-24 |
| 7733655 |
Lid edge capping load |
Mohamed Belazzouz, Peter J. Brofman, David L. Edwards, Kamal K. Sikka, Jiantao Zheng +1 more |
2010-06-08 |
