Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11882645 | Multi chip hardware security module | Sushumna Iruvanti, James A. Busby, Philipp K Buchling Rego, Thomas A. Wassick, William Santiago-Fernandez +1 more | 2024-01-23 |
| 11308257 | Stacked via rivets in chip hotspots | Dureseti Chidambarrao, David Wolpert, Atsushi Ogino, Matthew T. Guzowski, Tuhin Sinha +1 more | 2022-04-19 |
| 11239183 | Mitigating thermal-mechanical strain and warpage of an organic laminate substrate | Tuhin Sinha, Krishna R. Tunga, Brian W. Quinlan, Charles L. Arvin, Thomas Weiss | 2022-02-01 |
| 11228124 | Connecting a component to a substrate by adhesion to an oxidized solder surface | Mark K. Hoffmeyer, Thomas Weiss, Thomas E. Lombardi | 2022-01-18 |
| 11211262 | Electronic apparatus having inter-chip stiffener | Tuhin Sinha, Bhupender Singh, Sylvain Ouimet | 2021-12-28 |
| 10777482 | Multipart lid for a semiconductor package with multiple components | Charles L. Arvin, Krishna R. Tunga | 2020-09-15 |
| 10325830 | Multipart lid for a semiconductor package with multiple components | Charles L. Arvin, Krishna R. Tunga | 2019-06-18 |
| 9947598 | Determining crackstop strength of integrated circuit assembly at the wafer level | Krishna R. Tunga, Karen P. McLaughlin, Charles L. Arvin, Brian R. Sundlof, Christopher D. Muzzy +1 more | 2018-04-17 |
| 9601423 | Under die surface mounted electrical elements | Charles L. Arvin, Jon A. Casey, Brian M. Erwin, Brian W. Quinlan | 2017-03-21 |
| 9543253 | Method for shaping a laminate substrate | Edmund Blackshear, Thomas E. Lombardi, Donald A. Merte, Thomas Weiss, Jiantao Zheng | 2017-01-10 |
| 9366591 | Determining magnitude of compressive loading | Paul F. Bodenweber, Virendra R. Jadhav, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz | 2016-06-14 |
| 9272498 | Precast thermal interface adhesive for easy and repeated, separation and remating | Evan G. Colgan, Paul W. Coteus, Michael A. Gaynes, Kenneth C. Marston | 2016-03-01 |
| 9219051 | Laminate peripheral clamping to control microelectronic module BSM warpage | Stephanie Allard, Martin Beaumier, Jean-Francois Drapeau, Jean Labonte, Sylvain Ouimet | 2015-12-22 |
| 9059240 | Fixture for shaping a laminate substrate | Edmund Blackshear, Thomas E. Lombardi, Donald A. Merte, Thomas Weiss, Jiantao Zheng | 2015-06-16 |
| 9048245 | Method for shaping a laminate substrate | Edmund Blackshear, Thomas E. Lombardi, Donald A. Merte, Thomas Weiss, Jiantao Zheng | 2015-06-02 |
| 8906809 | Multichip electronic packages and methods of manufacture | Martin Beaumier, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2014-12-09 |
| 8900927 | Multichip electronic packages and methods of manufacture | Martin Beaumier, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2014-12-02 |
| 8794079 | Determining magnitude of compressive loading | Paul F. Bodenweber, Virendra R. Jadhav, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz | 2014-08-05 |
| 8492199 | Reworkable underfills for ceramic MCM C4 protection | Jeffrey T. Coffin, Frank L. Pompeo, Jiali Wu | 2013-07-23 |
| 8363404 | Implementing loading and heat removal for hub module assembly | John L. Colbert, Jason R. Eagle, Roger Duane Hamilton, Kenneth C. Marston | 2013-01-29 |
| 8268389 | Precast thermal interface adhesive for easy and repeated, separation and remating | Evan G. Colgan, Paul W. Coteus, Michael A. Gaynes, Kenneth C. Marston | 2012-09-18 |
| 8085550 | Implementing enhanced solder joint robustness for SMT pad structure | Mark K. Hoffmeyer, Sri M. Sri-Jayantha | 2011-12-27 |
| 7816785 | Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package | Sushumna Iruvanti, Randall G. Kemink, Rajneesh Kumar, Prabjit Singh | 2010-10-19 |
| 7786579 | Apparatus for crack prevention in integrated circuit packages | Jean Audet, Anson J. Call, Douglas O. Powell, Roger D. Weekly | 2010-08-31 |
| 7462294 | Enhanced thermal conducting formulations | Rajneesh Kumar | 2008-12-09 |