Issued Patents All Time
Showing 1–25 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817359 | Warp mitigation using pattern-matched metal layers in organic substrates | Hien Dang | 2023-11-14 |
| 11570928 | Server node connector mating condition health monitoring and reporting | Hien Dang, Vijayeshwar D. Khanna | 2023-01-31 |
| 11545415 | Pressure controllable encapsulated liquid thermal interface | Gerard McVicker | 2023-01-03 |
| 11315803 | Stress mitigation in organic laminates | Soojae Park | 2022-04-26 |
| 11245075 | Optimum warp in organic substrates | Vijayeshwar D. Khanna, Arun Sharma, Hien Dang | 2022-02-08 |
| 10886229 | Controlling warp in semiconductor laminated substrates with conductive material layout and orientation | Hien Dang | 2021-01-05 |
| 10834844 | Server node connnector mating condition health monitoring and reporting | Hien Dang, Vijayeshwar D. Khanna | 2020-11-10 |
| 10796978 | TIM strain mitigation in electronic modules | Gerard McVicker | 2020-10-06 |
| 10790232 | Controlling warp in semiconductor laminated substrates with conductive material layout and orientation | Hien Dang | 2020-09-29 |
| 10750615 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2020-08-18 |
| 10371729 | Real-time estimation of solar irradiation | Hien Dang | 2019-08-06 |
| 10368441 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2019-07-30 |
| 10325829 | TIM strain mitigation in electronic modules | Gerard McVicker | 2019-06-18 |
| 9974179 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2018-05-15 |
| 9837332 | TIM strain mitigation in electronic modules | Gerard McVicker | 2017-12-05 |
| 9627784 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2017-04-18 |
| 9550258 | Method and system for thermomechanically decoupling heatsink | Gerard McVicker, Vijayeshwar D. Khanna | 2017-01-24 |
| 9508789 | Electronic components on trenched substrates and method of forming same | David L. Questad, Vijayeshwar D. Khanna, Jennifer V. Muncy, Arun Sharma, Lorenzo Valdevit | 2016-11-29 |
| 9437519 | Tim strain mitigation in electronic modules | Gerard McVicker | 2016-09-06 |
| 9227261 | Vacuum carriers for substrate bonding | Vijayeshwar D. Khanna | 2016-01-05 |
| 9171742 | Alignment of integrated circuit chip stack | Evan G. Colgan, Steven A. Cordes, Daniel C. Edelstein, Vijayeshwar D. Khanna, Kenneth F. Latzko +4 more | 2015-10-27 |
| 9099458 | Construction of reliable stacked via in electronic substrates—vertical stiffness control method | Karan Kacker, Douglas O. Powell, David L. Questad, David J. Russell | 2015-08-04 |
| 8987031 | Fabricating a small-scale radiation detector | Michael S. Gordon, Christopher V. Jahnes, Eric A. Joseph, Hiroyuki Miyazoe, Kenneth P. Rodbell +1 more | 2015-03-24 |
| 8877552 | Method and apparatus for manufacturing electronic integrated circuit chip | — | 2014-11-04 |
| 8866026 | Construction of reliable stacked via in electronic substrates—vertical stiffness control method | Karan Kacker, Douglas O. Powell, David L. Questad, David J. Russell | 2014-10-21 |