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Hien Dang

IBM: 50 patents #1,732 of 70,183Top 3%
HG HGST: 7 patents #263 of 1,677Top 20%
HB Hitachi Global Technologies Netherlands B.V.: 1 patents #2 of 42Top 5%
Overall (All Time): #41,698 of 4,157,543Top 2%
58
Patents All Time

Issued Patents All Time

Showing 25 most recent of 58 patents

Patent #TitleCo-InventorsDate
11817359 Warp mitigation using pattern-matched metal layers in organic substrates Sri M. Sri-Jayantha 2023-11-14
11570928 Server node connector mating condition health monitoring and reporting Sri M. Sri-Jayantha, Vijayeshwar D. Khanna 2023-01-31
11245075 Optimum warp in organic substrates Sri M. Sri-Jayantha, Vijayeshwar D. Khanna, Arun Sharma 2022-02-08
10886229 Controlling warp in semiconductor laminated substrates with conductive material layout and orientation Sri M. Sri-Jayantha 2021-01-05
10834844 Server node connnector mating condition health monitoring and reporting Sri M. Sri-Jayantha, Vijayeshwar D. Khanna 2020-11-10
10790232 Controlling warp in semiconductor laminated substrates with conductive material layout and orientation Sri M. Sri-Jayantha 2020-09-29
10371729 Real-time estimation of solar irradiation Sri M. Sri-Jayantha 2019-08-06
9107327 Data center cooling method Timothy J. Chainer, Pritish R. Parida, Mark D. Schultz, Arun Sharma 2015-08-11
8978401 Data center cooling system Timothy J. Chainer, Pritish R. Parida, Mark D. Schultz, Arun Sharma 2015-03-17
8345955 Characterizing thermomechanical properties of an organic substrate using finite element analysis Arun Sharma, Sri M. Sri-Jayantha 2013-01-01
8235593 Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit Sri M. Sri-Jayantha, Arun Sharma 2012-08-07
8127255 Method to extract and apply circuit features in organic substrate for automation of warp modeling Vijayeshwar D. Khanna, Arun Sharma, Sri M. Sri-Jayantha 2012-02-28
8096705 Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit Sri M. Sri-Jayantha, Arun Sharma 2012-01-17
8056027 Characterizing thermomechanical properties of an organic substrate using three-dimensional finite element analysis Vijaveshwar Das Khanna, Arun Sharma, Sri M. Sri-Jayantha 2011-11-08
7904185 System and method for sensor replication for ensemble averaging in micro-electromechanical system (MEMS) Sri M. Sri-Jayantha, Arun Sharma, Evangelos S. Eleftheriou, Mark A. Lantz, Charalampos Pozidis 2011-03-08
7901998 Packaging substrate having pattern-matched metal layers Sri M. Sri-Jayantha, Vijayeshwar D. Khanna, Arun Sharma 2011-03-08
7856495 Identification of equipment location in data center Timothy J. Chainer 2010-12-21
7820488 Microelectronic devices and methods Sri M. Sri-Jayantha, Gareth G. Hougham, Sung Kwon Kang, Lawrence S. Mok, Arun Sharma 2010-10-26
7792943 Identification of equipment location in data center Timothy J. Chainer 2010-09-07
7759787 Packaging substrate having pattern-matched metal layers Sri M. Sri-Jayantha, Vijayeshwar D. Khanna, Arun Sharma 2010-07-20
7748895 Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit Sri M. Sri-Jayantha, Arun Sharma 2010-07-06
7741834 Method to monitor substrate viability by a sensor mounted to a substrate Sri M. Sri-Jayantha 2010-06-22
7724457 Method and system for time-shift based rotational vibration sensing in disk drives Isao Yoneda, Tetsuo Ueda, Yuzo Nakagawa, Sri M. Sri-Jayantha 2010-05-25
7711968 Instruction set with thermal opcode for high-performance microprocessor, microprocessor, and method therefor Arun Sharma, Sri M. Sri-Jayantha 2010-05-04
7710059 Method of optimizing servo controller power in two-dimensional flexure MEMS storage device Sri M. Sri-Jayantha 2010-05-04