Issued Patents All Time
Showing 1–25 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791270 | Direct bonded heterogeneous integration silicon bridge | Kamal K. Sikka, Maryse Cournoyer, Pascale Gagnon, Charles C. Bureau, Catherine Dufort +8 more | 2023-10-17 |
| 11570928 | Server node connector mating condition health monitoring and reporting | Sri M. Sri-Jayantha, Hien Dang | 2023-01-31 |
| 11245075 | Optimum warp in organic substrates | Sri M. Sri-Jayantha, Arun Sharma, Hien Dang | 2022-02-08 |
| 10834844 | Server node connnector mating condition health monitoring and reporting | Sri M. Sri-Jayantha, Hien Dang | 2020-11-10 |
| 10276534 | Reduction of solder interconnect stress | Anson J. Call, David J. Russell, Krishna R. Tunga | 2019-04-30 |
| 10276535 | Method of fabricating contacts of an electronic package structure to reduce solder interconnect stress | Anson J. Call, David J. Russell, Krishna R. Tunga | 2019-04-30 |
| 10108753 | Laminate substrate thermal warpage prediction for designing a laminate substrate | Anson J. Call, David J. Russell, Krishna R. Tunga | 2018-10-23 |
| 9865557 | Reduction of solder interconnect stress | Anson J. Call, David J. Russell, Krishna R. Tunga | 2018-01-09 |
| 9659131 | Copper feature design for warpage control of substrates | Edmund Blackshear, Anson J. Call, Douglas O. Powell, David J. Russell | 2017-05-23 |
| 9630269 | Mechanism to attach a die to a substrate | Mohammed S. Shaikh | 2017-04-25 |
| 9563732 | In-plane copper imbalance for warpage prediction | Anson J. Call, David J. Russell, Krishna R. Tunga | 2017-02-07 |
| 9550258 | Method and system for thermomechanically decoupling heatsink | Sri M. Sri-Jayantha, Gerard McVicker | 2017-01-24 |
| 9508789 | Electronic components on trenched substrates and method of forming same | David L. Questad, Jennifer V. Muncy, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit | 2016-11-29 |
| 9305894 | Constrained die adhesion cure process | Edmund Blackshear, Oswald J. Mantilla | 2016-04-05 |
| 9227261 | Vacuum carriers for substrate bonding | Sri M. Sri-Jayantha | 2016-01-05 |
| 9171742 | Alignment of integrated circuit chip stack | Evan G. Colgan, Steven A. Cordes, Daniel C. Edelstein, Kenneth F. Latzko, Qinghuang Lin +4 more | 2015-10-27 |
| 9105535 | Copper feature design for warpage control of substrates | Edmund Blackshear, Anson J. Call, Douglas O. Powell, David J. Russell | 2015-08-11 |
| 8685833 | Stress reduction means for warp control of substrates through clamping | Sri M. Sri-Jayantha | 2014-04-01 |
| 8624152 | Negative coefficient thermal expansion engineered particles for composite fabrication | Gareth G. Hougham, Xiao Hu Liu, Gerard McVicker | 2014-01-07 |
| 8322980 | Heat transfer device in a rotating structure | Gerard McVicker, Sri M. Sri-Jayantha | 2012-12-04 |
| 8138448 | Negative coefficient thermal expansion engineered particles for composite fabrication | Gareth G. Hougham, Xiao Hu Liu, Gerard McVicker | 2012-03-20 |
| 8127255 | Method to extract and apply circuit features in organic substrate for automation of warp modeling | Hien Dang, Arun Sharma, Sri M. Sri-Jayantha | 2012-02-28 |
| 8054630 | Electronic components on trenched substrates and method of forming same | David L. Questad, Jennifer V. Muney, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit | 2011-11-08 |
| 7901998 | Packaging substrate having pattern-matched metal layers | Sri M. Sri-Jayantha, Hien Dang, Arun Sharma | 2011-03-08 |
| 7896611 | Heat transfer device in a rotating structure | Gerard McVicker, Sri M. Sri-Jayantha | 2011-03-01 |