| 11545415 |
Pressure controllable encapsulated liquid thermal interface |
Sri M. Sri-Jayantha |
2023-01-03 |
$14,209,000 |
| 11276256 |
Traffic event recording and recreation |
Timothy J. Chainer, Pritish R. Parida |
2022-03-15 |
$585,478,000 |
| 11074831 |
Personal food database |
Timothy J. Chainer, Pritish R. Parida |
2021-07-27 |
$4,187,000 |
| 10796978 |
TIM strain mitigation in electronic modules |
Sri M. Sri-Jayantha |
2020-10-06 |
$5,751,000 |
| 10607963 |
Chip package for two-phase cooling and assembly process thereof |
Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Michael A. Gaynes, Jeffrey D. Gelorme +4 more |
2020-03-31 |
$1,667,000 |
| 10325829 |
TIM strain mitigation in electronic modules |
Sri M. Sri-Jayantha |
2019-06-18 |
$3,033,000 |
| 9837332 |
TIM strain mitigation in electronic modules |
Sri M. Sri-Jayantha |
2017-12-05 |
$3,039,000 |
| 9830823 |
Detection of vehicle operation characteristics |
Timothy J. Chainer, Pritish R. Parida |
2017-11-28 |
$4,993,000 |
| 9565759 |
Axiocentric scrubbing land grid array contacts and methods for fabrication |
Gareth G. Hougham, Xiaoxiong Gu, Sung K. Kang, Frank R. Libsch, Xiao Hu Liu |
2017-02-07 |
$20,132,000 |
| 9550258 |
Method and system for thermomechanically decoupling heatsink |
Sri M. Sri-Jayantha, Vijayeshwar D. Khanna |
2017-01-24 |
$6,909,000 |
| 9437519 |
Tim strain mitigation in electronic modules |
Sri M. Sri-Jayantha |
2016-09-06 |
$4,975,000 |
| 9410261 |
Two mask process for electroplating metal employing a negative electrophoretic photoresist |
Gareth G. Hougham, Anna Pratt |
2016-08-09 |
$2,792,000 |
| 9340892 |
Two mask process for electroplating metal employing a negative electrophoretic photoresist |
Gareth G. Hougham, Anna Pratt |
2016-05-17 |
$1,734,000 |
| 9040841 |
Axiocentric scrubbing land grid array contacts and methods for fabrication |
Gareth G. Hougham, Xiaoxiong Gu, Sung K. Kang, Frank R. Libsch, Xiao Hu Liu |
2015-05-26 |
$2,909,000 |
| 8959764 |
Metallurgical clamshell methods for micro land grid array fabrication |
Gareth G. Hougham, Xiaoxiong Gu |
2015-02-24 |
$3,851,000 |
| 8651877 |
Metallurgical clamshell methods for micro land grid array fabrication |
Gareth G. Hougham, Xiaoxiong Gu |
2014-02-18 |
$4,910,000 |
| 8624152 |
Negative coefficient thermal expansion engineered particles for composite fabrication |
Gareth G. Hougham, Vijayeshwar D. Khanna, Xiao Hu Liu |
2014-01-07 |
$4,729,000 |
| 8322980 |
Heat transfer device in a rotating structure |
Vijayeshwar D. Khanna, Sri M. Sri-Jayantha |
2012-12-04 |
$3,998,000 |
| 8263879 |
Axiocentric scrubbing land grid array contacts and methods for fabrication |
Gareth G. Hougham, Xiaoxiong Gu, Sung K. Kang, Frank R. Libsch, Xiao Hu Liu |
2012-09-11 |
$6,476,000 |
| 8138448 |
Negative coefficient thermal expansion engineered particles for composite fabrication |
Gareth G. Hougham, Vijayeshwar D. Khanna, Xiao Hu Liu |
2012-03-20 |
$2,170,000 |
| 7896611 |
Heat transfer device in a rotating structure |
Vijayeshwar D. Khanna, Sri M. Sri-Jayantha |
2011-03-01 |
$4,705,000 |
| 7836353 |
Method to enhance micro-C4 reliability by reducing the impact of hot spot pulsing |
John U. Knickerbocker, Sri M. Sri-Jayantha |
2010-11-16 |
$4,384,000 |
| 7781883 |
Electronic package with a thermal interposer and method of manufacturing the same |
Sri M. Sri-Jayantha, John U. Knickerbocker |
2010-08-24 |
$3,306,000 |
| 7667969 |
Pump structures integral to a fluid filled heat transfer apparatus |
Vijayeshwar D. Khanna, Sri M. Sri-Jayantha |
2010-02-23 |
$6,192,000 |
| 7612446 |
Structures to enhance cooling of computer memory modules |
Hien Dang, Vinod Kamath, Vijayeshwar D. Khanna, Sri M. Sri-Jayantha, Jung Hyuk YOON |
2009-11-03 |
$14,110,000 |
